Patents by Inventor Shoko Ono

Shoko Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10759964
    Abstract: A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: September 1, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa Kayaba, Hirofumi Tanaka, Hiroko Wachi, Shoko Ono
  • Patent number: 10580639
    Abstract: The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: March 3, 2020
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa Kayaba, Hirofumi Tanaka, Shoko Ono, Koji Inoue, Hiroko Wachi, Tsuneji Suzuki
  • Publication number: 20190187560
    Abstract: A composition for forming a metal-containing film, the composition including: a compound (A) which is at least one selected from the group consisting of: a compound (a1) containing a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom, and a compound (a2) which is a compound other than the compound (a1) and which contains a nitrogen atom; and a compound (B) which is at least one selected from the group consisting of: a compound (b1) containing a carboxy group and at least one of a germanium atom, a tin atom, a selenium atom or a zirconium atom, and an ester of the compound (b1).
    Type: Application
    Filed: May 19, 2017
    Publication date: June 20, 2019
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Shoko ONO, Hirofumi TANAKA
  • Publication number: 20180327547
    Abstract: A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(?O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(?O)OX groups are —C(?O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.
    Type: Application
    Filed: November 16, 2016
    Publication date: November 15, 2018
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Hirofumi TANAKA, Hiroko WACHI, Shoko ONO
  • Patent number: 10043677
    Abstract: A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)1/2 or less, to the region including the recessed part of the member into which the first coating liquid has been filled.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: August 7, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Hirofumi Tanaka, Yasuhisa Kayaba, Hiroko Wachi, Koji Inoue, Shoko Ono
  • Patent number: 10020238
    Abstract: Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B< the pH of the composition<the isoelectric point of a surface of the member A; and an application process of applying the composition to the surface of the member A and the surface of the member B included in the composite member.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: July 10, 2018
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa Kayaba, Shoko Ono, Hirofumi Tanaka, Tsuneji Suzuki, Shigeru Mio, Kazuo Kohmura
  • Publication number: 20180076047
    Abstract: A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)1/2 or less, to the region including the recessed part of the member into which the first coating liquid has been filled.
    Type: Application
    Filed: March 24, 2016
    Publication date: March 15, 2018
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Hirofumi TANAKA, Yasuhisa KAYABA, Hiroko WACHI, Koji INOUE, Shoko ONO
  • Publication number: 20170372993
    Abstract: A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.
    Type: Application
    Filed: December 14, 2015
    Publication date: December 28, 2017
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Yasuhisa KAYABA, Shoko ONO, Hirofumi TANAKA, Koji INOUE, Hiroko WACHI
  • Patent number: 9780008
    Abstract: A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: October 3, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki
  • Publication number: 20170162382
    Abstract: The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.
    Type: Application
    Filed: August 5, 2015
    Publication date: June 8, 2017
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Hirofumi TANAKA, Shoko ONO, Koji INOUE, Hiroko WACHI, Tsuneji SUZUKI
  • Publication number: 20160049343
    Abstract: Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B< the pH of the composition<the isoelectric point of a surface of the member A; and an application process of applying the composition to the surface of the member A and the surface of the member B included in the composite member.
    Type: Application
    Filed: March 11, 2014
    Publication date: February 18, 2016
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yasuhisa KAYABA, Shoko ONO, Hirofumi TANAKA, Tsuneji SUZUKI, Shigeru MIO, Kazuo KOHMURA
  • Patent number: 9169353
    Abstract: In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: October 27, 2015
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki, Shigeru Mio
  • Publication number: 20150187670
    Abstract: A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.
    Type: Application
    Filed: July 12, 2013
    Publication date: July 2, 2015
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki
  • Patent number: 8956977
    Abstract: The present invention provides a semiconductor device production method and a rinse used in the production method. The method includes: a sealing composition application process in which a semiconductor sealing layer is formed by applying, to at least a portion of a surface of a semiconductor substrate, a semiconductor sealing composition that includes a resin having a cationic functional group and a weight average molecular weight of from 2,000 to 600,000, wherein a content of sodium and a content of potassium are 10 mass ppb or less on an elemental basis, respectively; and, subsequently, a rinsing process in which the surface of the semiconductor substrate on which the semiconductor sealing layer has been formed is rinsed with a rinse having a pH at 25° C. of 6 or lower.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: February 17, 2015
    Assignee: Mitsu Chemicals, Inc.
    Inventors: Shoko Ono, Kazuo Kohmura, Hirofumi Tanaka
  • Publication number: 20140367868
    Abstract: In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.
    Type: Application
    Filed: January 16, 2013
    Publication date: December 18, 2014
    Inventors: Shoko Ono, Yasuhisa Kayaba, Hirofumi Tanaka, Kazuo Kohmura, Tsuneji Suzuki, Shigeru Mio
  • Publication number: 20130171826
    Abstract: The present invention provides a semiconductor device production method and a rinse used in the production method. The method includes: a sealing composition application process in which a semiconductor sealing layer is formed by applying, to at least a portion of a surface of a semiconductor substrate, a semiconductor sealing composition that includes a resin having a cationic functional group and a weight average molecular weight of from 2,000 to 600,000, wherein a content of sodium and a content of potassium are 10 mass ppb or less on an elemental basis, respectively; and, subsequently, a rinsing process in which the surface of the semiconductor substrate on which the semiconductor sealing layer has been formed is rinsed with a rinse having a pH at 25° C. of 6 or lower.
    Type: Application
    Filed: September 8, 2011
    Publication date: July 4, 2013
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Kazuo Kohmura, Hirofumi Tanaka
  • Patent number: 8304924
    Abstract: The invention provides a composition for sealing a semiconductor, the composition being able to form a thin resin layer, suppress the diffusion of a metal component to a porous interlayer dielectric layer, and exhibit superior adherence with respect to an interconnection material. The composition for sealing a semiconductor contains a resin having two or more cationic functional groups and a weight-average molecular weight of from 2,000 to 100,000; contains sodium and potassium each in an amount based on element content of not more than 10 ppb by weight; and has a volume average particle diameter, measured by a dynamic light scattering method, of not more than 10 nm.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: November 6, 2012
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Shoko Ono, Kazuo Kohmura
  • Publication number: 20110241210
    Abstract: The invention provides a composition for sealing a semiconductor, the composition being able to form a thin resin layer, suppress the diffusion of a metal component to a porous interlayer dielectric layer, and exhibit superior adherence with respect to an interconnection material. The composition for sealing a semiconductor contains a resin having two or more cationic functional groups and a weight-average molecular weight of from 2,000 to 100,000; contains sodium and potassium each in an amount based on element content of not more than 10 ppb by weight; and has a volume average particle diameter, measured by a dynamic light scattering method, of not more than 10 nm.
    Type: Application
    Filed: May 28, 2010
    Publication date: October 6, 2011
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Shoko Ono, Kazuo Kohmura
  • Publication number: 20080131635
    Abstract: This invention relates to: a laminate comprising a support, a multilayer film assembled via a hydrogen bond thereon, and a thin film thereon; a self-supported thin film obtained from such laminate; a method for producing such laminate comprising allowing a support to come into contact alternately with two or more types of solutions comprising substances to be laminated to form a multilayer film and forming a thin film via a method selected from among vapor deposition, spin coating, and layer-by-layer adsorption; a method for producing a self-supported thin film comprising immersing the laminate in a pH-adjusted aqueous solution to dissolve the multilayer film and to separate the thin film from the support; a thin film for cell culture and a capsule for a controlled-release drug obtained from the laminate; and a sensor, a separation film, a device for catalytic reactions, and a sample slice for transmission assay obtained from such thin film.
    Type: Application
    Filed: November 11, 2005
    Publication date: June 5, 2008
    Applicants: Centre National De La Racherche Scientifique, Mitsui Chemicals, Inc.
    Inventors: Shoko Ono, Gero Decher