Abstract: The combine may include a threshing tank that is configured to store a threshing product obtained by the threshing device and includes a lower tapered portion formed in a bottom portion. A bottom screw is provided inside the lower tapered portion and configured to discharge the threshing product from the threshing tank. A threshing discharge device is connected to the bottom screw and configured to convey the threshing product from the bottom screw and discharge the threshing product in a body outward direction. The threshing tank includes an inspection port formed in a bottom section of the lower tapered portion, and a lid configured to open and close the inspection port, and the lid opens and closes by swinging upward and downward about a swing axis that is not parallel with a screw axis of the bottom screw.

Abstract: A module includes a substrate and a first metal member. The substrate has an upper main surface and a lower main surface arranged in an up-down direction. The first metal member includes a first plate-shaped portion provided on the upper main surface of the substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The first metal member further includes a first left support portion. A boundary between the first plate-shaped portion and the first left support portion is defined as a first left boundary. The first left support portion bends with respect to the first plate-shaped portion at the first left boundary so as to be located behind the first plate-shaped portion.

Abstract: A module includes a substrate having an upper main surface and a lower main surface arranged in an up-down direction, and a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface, a back main surface, and a lower end surface arranged in the front-back direction when viewed in the up-down direction. The lower end surface of the plate-shaped portion includes a straight portion extending in the left-right direction and one or more protruding portions protruding in the forward direction or the backward direction with respect to the straight portion, and the straight portion and the one or more protruding portions are visually recognized when viewed in the upward direction.

Abstract: In a module, a metal member includes a right support portion, the right support portion has a right support foremost portion located at a foremost in the right support portion and located in front of the plate-shaped portion, the right support portion bends in a forward direction from a right boundary when the right support portion has the right support foremost portion, the right support portion bends in a backward direction and a right direction from the right support foremost portion when the right support portion has the right support foremost portion, and the right support portion is provided with a first lower notch extending in an upward direction from a lower side and overlapping the right support foremost portion when viewed in the up-down direction.

Abstract: A module includes: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member provided on the upper main surface of the substrate, the metal member having a plate-shaped portion including a front main surface and a back main surface arranged in a front-back direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member. The metal member includes an upper protruding portion extending on one side of the front-back direction from an upper end of the plate-shaped portion.

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The metal member further includes one or more foot portions extending forward or backward from the lower side.

Abstract: A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface of the resin member, and a metallic shield plate arranged on the main surface and between the circuit component and the circuit component when the main surface is viewed in a plan view. The metallic shield plate is in contact with the metallic shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member.

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.

Abstract: A metal member includes a plate-shaped portion extending upward from an upper main surface of a substrate, and has a front main surface and a back main surface arranged in the front-back direction when viewed in the up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side.

Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. The metal member is provided on the upper main surface of the substrate. The metal member includes a plate-shaped portion and one or more foot portions. The plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction. The one or more foot portions extend backward from the lower side by bending the metal member at the lower side of the plate-shaped portion. A line extending in a predetermined direction is provided on the front main surface, the back main surface, the outer surface of the portion where the metal member is bent, and the inner surface of the portion where the metal member is bent.

Abstract: A heat insulating material (1) includes a heat insulating layer (10) which has a porous structural body, a reinforcing fiber, and nanoparticles of a metal oxide used as a binder, wherein the porous structural body has a skeleton formed by connecting a plurality of particles, has pores inside, and has a hydrophobic portion on at least one surface between a surface and an inside of the porous structural body. The heat insulating layer (10) has a mass loss rate of 10% or less in thermogravimetric analysis held at 500° C. for 30 minutes.

Abstract: A fluid device composite member includes: a silicone member that includes a body part which is made of silicone and which has a flow-path-defining section for defining a flow path on one surface of the body part, and that includes barrier layer having hydrophilicity or hydrophobicity disposed in at least a portion of the flow-path-defining section; and a resin substrate disposed on another surface of the body part opposite to the one surface. This method for manufacturing the fluid device composite member includes a layered body manufacturing step in which a liquid silicone material is placed on a surface of the resin substrate, and the liquid silicone material is cured at a temperature of 100° C. or less to obtain a layered body in which a silicone cured product is bonded to the resin substrate.

Abstract: A combine harvester is provided with: a threshing device that performs a threshing process of threshing a crop; a grain tank that stores grain obtained by the threshing process; a grain discharging device that discharges grain to be stored in the grain tank to the outside of the vehicle body; a travel driving device that drives travel of the vehicle body; and an engine that serves as a power source. The combine harvester includes a first relay shaft to which power is transmitted from an output shaft of the engine, and the power of the engine is transmitted from the first relay shaft to the grain discharging device and the travel driving device in a branched manner.

Abstract: A thermal insulation material for a battery pack includes: a thermal insulation layer; and a first base material and a second base material that are arranged with the thermal insulation layer interposed therebetween. The thermal insulation layer contains a porous structure in which a plurality of particles is connected to form a skeleton, reinforcing fibers, and metal oxide nanoparticles serving as a binder, the porous structure having pores inside and having hydrophobic sites at least on a surface of the porous structure out of the surface and inside of the porous structure, and a percentage mass loss of the thermal insulation layer in thermogravimetric analysis in which the thermal insulation layer is held at 500° C. for 30 minutes is 10% or less.

Abstract: A heat insulating material (1) includes a heat insulating layer (10) which has a porous structural body, a reinforcing fiber, and nanoparticles of a metal oxide used as a binder, wherein the porous structural body has a skeleton formed by connecting a plurality of particles, has pores inside, and has a hydrophobic portion on at least one surface between a surface and an inside of the porous structural body. The heat insulating layer (10) has a mass loss rate of 10% or less in thermogravimetric analysis held at 500° C. for 30 minutes.

Abstract: A lid is supported so as to be open and close by swinging upward and downward about a swing axis that is not parallel with the screw axis of a bottom screw.

Abstract: A combine harvester is provided with: a threshing device that performs a threshing process of threshing a crop; a grain tank that stores grain obtained by the threshing process; a grain discharging device that discharges grain to be stored in the grain tank to the outside of the vehicle body; a travel driving device that drives travel of the vehicle body; and an engine that serves as a power source. The combine harvester includes a first relay shaft to which power is transmitted from an output shaft of the engine, and the power of the engine is transmitted from the first relay shaft to the grain discharging device and the travel driving device in a branched manner.

Abstract: There is disclosed a method for manufacturing an electrode by pressing and sintering a mixed powder of a solid solution powder of Cr and a heat-resistant element, which contains Cr and the heat-resistant element in a ratio such that Cr is greater than the heat-resistant element by weight, a Cu powder, and a low melting metal powder (Bi, Sn, Se, Pb, etc.). The low melting metal powder of 0.30 weight % to 0.50 weight % is added to a mixed powder of a solid solution powder of Cr and the heat-resistant element and the Cu powder, and then a mixed powder prepared by adding the low melting metal powder is sintered at a temperature of from 1010° C. to 1035° C. As the low melting metal powder, there is used a powder having a median size of from 5 ?m to 20 ?m.

Abstract: A fluid device composite member includes: a silicone member that includes a body part which is made of silicone and which has a flow-path-defining section for defining a flow path on one surface of the body part, and that includes barrier layer having hydrophilicity or hydrophobicity disposed in at least a portion of the flow-path-defining section; and a resin substrate disposed on another surface of the body part opposite to the one surface. This method for manufacturing the fluid device composite member includes a layered body manufacturing step in which a liquid silicone material is placed on a surface of the resin substrate, and the liquid silicone material is cured at a temperature of 100° C. or less to obtain a layered body in which a silicone cured product is bonded to the resin substrate.