Patents by Inventor Shota IWAHATA
Shota IWAHATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240035141Abstract: A substrate processing method includes an oxidation step of heating a plurality of substrates inside an oxidation space while supplying an oxygen gas or an ozone gas to the plurality of substrates to change surface layers of molybdenum films to molybdenum trioxide, a first transfer step of transferring the plurality of substrates inside the oxidation space to an etching space inside the substrate processing apparatus differing from the oxidation space, and an etching step of supplying an etching liquid to the plurality of substrates inside the etching space to make the surface layers that changed to the molybdenum trioxide dissolve in the etching liquid while leaving, on the substrate, portions other than the surface layers of the molybdenum films.Type: ApplicationFiled: July 28, 2023Publication date: February 1, 2024Inventors: Teppei NAKANO, Takayoshi TANAKA, Shota IWAHATA, Hiroyuki YASHIKI
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Patent number: 11260436Abstract: The substrate processing apparatus includes common piping which guides a processing liquid to a branching portion, supply piping which guides the processing liquid from the branching portion to a chemical liquid nozzle, return piping which guides the processing liquid from the branching portion, and a discharge valve which changes a flow rate of the processing liquid supplied from the common piping to the branching portion. The discharge valve makes a valve element stationary at a plurality of positions including a discharge execution position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate larger than a maximum value of a suction flow rate and a discharge stop position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate smaller than the maximum value of the suction flow rate.Type: GrantFiled: May 28, 2020Date of Patent: March 1, 2022Inventors: Naoyuki Osada, Takahiro Yamaguchi, Eri Fujita, Akihisa Iwasaki, Ayumi Higuchi, Shota Iwahata
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Patent number: 11094564Abstract: A processing liquid supplying apparatus supplies a processing liquid to a processing unit which processes a substrate.Type: GrantFiled: October 24, 2018Date of Patent: August 17, 2021Inventors: Shota Iwahata, Ayumi Higuchi, Eri Fujita, Yoshiyuki Fujitani, Masako Mano, Yusuke Takematsu, Yosuke Okuya
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Patent number: 10886133Abstract: A substrate processing method includes a substrate holding step of holding a substrate in which a pattern is defined on one major surface, a charge supply step of supplying a charge of one polarity to the substrate, a first voltage application step of applying, in parallel with the charge supply step, a voltage of the other polarity to a first electrode arranged on the other major surface of the substrate through a dielectric member, a second voltage application step of applying, after the first voltage application step, a voltage of the one polarity to the first electrode while keeping a state where a ground connection of the substrate is released and a drying step of removing, in parallel with the second voltage application step, a liquid from the one major surface of the substrate so as to dry the substrate.Type: GrantFiled: September 1, 2017Date of Patent: January 5, 2021Inventors: Daisuke Shimizu, Masayuki Otsuji, Shota Iwahata
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Patent number: 10816141Abstract: A chemical solution feeder feeds a chemical solution to a predetermined feed target, and includes: a feed flow path that is connected at its one end to a supply source of a chemical solution at room temperature and at its other end to a feed target, to guide the chemical solution to the feed target from the supply source; a first filter that removes particles in a chemical solution at room temperature injected from the supply source into the feed flow path; a heating unit that heats the chemical solution having passed through the first filter; and a second filter that removes particles in the chemical solution at high temperature heated by the heating unit, flowing through the feed flow path toward the feed target, wherein the first filter is a hydrophilic filter and the second filter is a hydrophobic filter.Type: GrantFiled: June 28, 2018Date of Patent: October 27, 2020Assignee: SCREEN Holdings Co., Ltd.Inventors: Ayumi Higuchi, Eri Fujita, Shota Iwahata, Masayuki Otsuji, Yoshiyuki Fujitani
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Publication number: 20200290101Abstract: The substrate processing apparatus includes common piping which guides a processing liquid to a branching portion, supply piping which guides the processing liquid from the branching portion to a chemical liquid nozzle, return piping which guides the processing liquid from the branching portion, and a discharge valve which changes a flow rate of the processing liquid supplied from the common piping to the branching portion. The discharge valve makes a valve element stationary at a plurality of positions including a discharge execution position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate larger than a maximum value of a suction flow rate and a discharge stop position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate smaller than the maximum value of the suction flow rate.Type: ApplicationFiled: May 28, 2020Publication date: September 17, 2020Inventors: Naoyuki OSADA, Takahiro YAMAGUCHI, Eri FUJITA, Akihisa IWASAKI, Ayumi HIGUCHI, Shota IWAHATA
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Patent number: 10717117Abstract: The substrate processing apparatus includes common piping which guides a processing liquid to a branching portion, supply piping which guides the processing liquid from the branching portion to a chemical liquid nozzle, return piping which guides the processing liquid from the branching portion, and a discharge valve which changes a flow rate of the processing liquid supplied from the common piping to the branching portion. The discharge valve makes a valve element stationary at a plurality of positions including a discharge execution position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate larger than a maximum value of a suction flow rate and a discharge stop position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate smaller than the maximum value of the suction flow rate.Type: GrantFiled: January 19, 2018Date of Patent: July 21, 2020Assignee: SCREEN Holdings Co., Ltd.Inventors: Naoyuki Osada, Takahiro Yamaguchi, Eri Fujita, Akihisa Iwasaki, Ayumi Higuchi, Shota Iwahata
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Patent number: 10651029Abstract: The controller is programmed to cause a low-surface-tension liquid supply unit to supply a liquid film of a low-surface-tension liquid to a front surface of a substrate so as to form a liquid film of the low-surface-tension liquid. The controller is programmed to control the substrate rotating unit and the inert gas supply unit so that an inert gas is supplied toward the rotational center position while rotating the substrate, thereby forming an opening spreading from the rotational center position to be formed in the liquid film, and enlarging the opening in a direction away from the rotational center position, and to control the landing-position changing unit to change the landing position of the low-surface-tension liquid to at least two positions except the rotational center position in accordance with enlargement of the opening so that the landing position is placed outside the peripheral edge of the opening.Type: GrantFiled: December 22, 2016Date of Patent: May 12, 2020Assignee: SCREEN Holdings Co., Ltd.Inventors: Hiroaki Takahashi, Kazunori Fujikawa, Tomonori Kojimaru, Tomomasa Ishida, Ayumi Higuchi, Naozumi Fujiwara, Kana Komori, Shota Iwahata
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Patent number: 10615026Abstract: A substrate processing method includes a liquid film forming step of forming a liquid film of an organic solvent with which a whole area of an upper surface of a substrate is covered in order to replace a processing liquid existing on the upper surface with an organic solvent liquid, a thin film holding step of thinning the liquid film of the organic solvent by rotating the substrate at a first high rotational speed while keeping surroundings of the whole area of the upper surface in an atmosphere of an organic solvent vapor and holding a resulting thin film of the organic solvent on the upper surface, and a thin-film removing step of removing the thin film from the upper surface after the thin film holding step, and the thin-film removing step includes a high-speed rotation step of rotating the substrate at a second high rotational speed.Type: GrantFiled: June 1, 2016Date of Patent: April 7, 2020Assignee: SCREEN Holdings Co., Ltd.Inventors: Shota Iwahata, Masayuki Otsuji
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Publication number: 20190267244Abstract: A substrate processing method includes a substrate holding step of holding a substrate in which a pattern is defined on one major surface, a charge supply step of supplying a charge of one polarity to the substrate, a first voltage application step of applying, in parallel with the charge supply step, a voltage of the other polarity to a first electrode arranged on the other major surface of the substrate through a dielectric member, a second voltage application step of applying, after the first voltage application step, a voltage of the one polarity to the first electrode while keeping a state where a ground connection of the substrate is released and a drying step of removing, in parallel with the second voltage application step, a liquid from the one major surface of the substrate so as to dry the substrate.Type: ApplicationFiled: September 1, 2017Publication date: August 29, 2019Inventors: Daisuke SHIMIZU, Masayuki OTSUJI, Shota IWAHATA
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Publication number: 20190131144Abstract: A processing liquid supplying apparatus supplies a processing liquid to a processing unit which processes a substrate.Type: ApplicationFiled: October 24, 2018Publication date: May 2, 2019Inventors: Shota IWAHATA, Ayumi HIGUCHI, Eri FUJITA, Yoshiyuki FUJITANI, Masako MANO, Yusuke TAKEMATSU, Yosuke OKUYA
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Publication number: 20190056066Abstract: A chemical solution feeder feeds a chemical solution to a predeteimined feed target, and includes: a feed flow path that is connected at its one end to a supply source of a chemical solution at room temperature and at its other end to a feed target, to guide the chemical solution to the feed target from the supply source; a first filter that removes particles in a chemical solution at room temperature injected from the supply source into the feed flow path; a heating unit that heats the chemical solution having passed through the first filter; and a second filter that removes particles in the chemical solution at high temperature heated by the heating unit, flowing through the feed flow path toward the feed target, wherein the first filter is a hydrophilic filter and the second filter is a hydrophobic filter.Type: ApplicationFiled: June 28, 2018Publication date: February 21, 2019Inventors: Ayumi HIGUCHI, Eri FUJITA, Shota IWAHATA, Masayuki OTSUJI, Yoshiyuki FUJITANI
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Publication number: 20180261449Abstract: A substrate processing method includes a liquid film forming step of forming a liquid film of an organic solvent with which a whole area of an upper surface of a substrate is covered in order to replace a processing liquid existing on the upper surface with an organic solvent liquid, a thin film holding step of thinning the liquid film of the organic solvent by rotating the substrate at a first high rotational speed while keeping surroundings of the whole area of the upper surface in an atmosphere of an organic solvent vapor and holding a resulting thin film of the organic solvent on the upper surface, and a thin-film removing step of removing the thin film from the upper surface after the thin film holding step, and the thin-film removing step includes a high-speed rotation step of rotating the substrate at a second high rotational speed.Type: ApplicationFiled: May 14, 2018Publication date: September 13, 2018Inventors: Shota IWAHATA, Masayuki OTSUJI
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Publication number: 20180236510Abstract: The substrate processing apparatus includes common piping which guides a processing liquid to a branching portion, supply piping which guides the processing liquid from the branching portion to a chemical liquid nozzle, return piping which guides the processing liquid from the branching portion, and a discharge valve which changes a flow rate of the processing liquid supplied from the common piping to the branching portion. The discharge valve makes a valve element stationary at a plurality of positions including a discharge execution position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate larger than a maximum value of a suction flow rate and a discharge stop position at which the processing liquid is supplied from the common piping to the branching portion at a flow rate smaller than the maximum value of the suction flow rate.Type: ApplicationFiled: January 19, 2018Publication date: August 23, 2018Inventors: Naoyuki OSADA, Takahiro YAMAGUCHI, Eri FUJITA, Akihisa IWASAKI, Ayumi HIGUCHI, Shota IWAHATA
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Publication number: 20170186599Abstract: The controller is programmed to cause a low-surface-tension liquid supply unit to supply a liquid film of a low-surface-tension liquid to a front surface of a substrate so as to form a liquid film of the low-surface-tension liquid. The controller is programmed to control the substrate rotating unit and the inert gas supply unit so that an inert gas is supplied toward the rotational center position while rotating the substrate, thereby forming an opening spreading from the rotational center position to be formed in the liquid film, and enlarging the opening in a direction away from the rotational center position, and to control the landing-position changing unit to change the landing position of the low-surface-tension liquid to at least two positions except the rotational center position in accordance with enlargement of the opening so that the landing position is placed outside the peripheral edge of the opening.Type: ApplicationFiled: December 22, 2016Publication date: June 29, 2017Inventors: Hiroaki TAKAHASHI, Kazunori FUJIKAWA, Tomonori KOJIMARU, Tomomasa ISHIDA, Ayumi HIGUCHI, Naozumi FUJIWARA, Kana KOMORI, Shota IWAHATA
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Publication number: 20160365238Abstract: A substrate processing method includes a liquid film forming step of forming a liquid film of an organic solvent with which a whole area of an upper surface of a substrate is covered in order to replace a processing liquid existing on the upper surface with an organic solvent liquid, a thin film holding step of thinning the liquid film of the organic solvent by rotating the substrate at a first high rotational speed while keeping surroundings of the whole area of the upper surface in an atmosphere of an organic solvent vapor and holding a resulting thin film of the organic solvent on the upper surface, and a thin-film removing step of removing the thin film from the upper surface after the thin film holding step, and the thin-film removing step includes a high-speed rotation step of rotating the substrate at a second high rotational speed.Type: ApplicationFiled: June 1, 2016Publication date: December 15, 2016Inventors: Shota IWAHATA, Masayuki OTSUJI