Abstract: A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.

Abstract: A method for producing a block copolymer that includes a step (A) of polymerizing a vinyl aromatic monomer at ?5° C. to 35° C. in a mixed solvent including at least one nonpolar solvent selected from methylcyclohexane and methylcyclopentane and an aprotic polar solvent using an anionic polymerization initiator; a step (B) of adding a conjugated diene monomer for further polymerization at ?5° C. to 35° C. after the step (A); and a step (C) of adding a vinyl aromatic monomer for further polymerization at ?5° C. to 35° C. after the step (B) if necessary.

Abstract: A photosensitive resin composition for flexographic printing includes components (A) to (E) below: (A) a first styrene-butadiene-styrene block copolymer (SBS); (B) a second styrene-butadiene-styrene block copolymer (SBS); (C) a polybutadiene or a derivative thereof; (D) a photopolymerizable monomer; and (E) a photopolymerization initiator, and comprises with respect to (A), 5 to 100 wt % of (B), 10 to 40 wt % of (C), 40 to 200 wt % of (D), and 4 to 20 wt % of (E).

Abstract: The present application provides a method for producing a cured product that includes: (I) heating a thermosetting composition containing a styrene-butadiene-styrene block copolymer (SBS) (A) and a thermal radical generator (B) within a temperature range of 120° C. to 180° C. until 30% or more of double bonds derived from 1,2-bond structure in a butadiene block react; and (II) then heating the thermosetting composition within a temperature range of 181° C. to 300° C. until 50% or more of the double bonds derived from 1,2-bond structure in a butadiene block react.

Abstract: A resin composition for a metal-clad laminate plate includes a block copolymer comprising a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. Further, the resin composition for the metal-clad laminate plate includes polybutadiene having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0.

Abstract: A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.