Abstract: A light-emitting device includes a substrate, a first light-emitting element mounted on the substrate, an annular transparent dam formed on the substrate so as to surround the first light-emitting element, a second light-emitting element that is mounted on the substrate so as to be embedded in an interior of the dam and that has a shorter peak emission wavelength than that of the first light-emitting element, and a sealing material filled inside the dam so as to seal the first light-emitting element.

Abstract: The present invention provides a LED package in which deterioration in heat radiation performance is suppressed. The LED package comprises a substrate, a light-emitting device mounted on the substrate, sealing resin sealing the light-emitting device and mixed with phosphor, a heat sink provided on a rear surface of the substrate, and a rear electrode provided on the rear surface of the substrate and electrically connected to the light-emitting device. The heat sink is provided at a distance from the rear electrode in a region except for the rear electrode. The heat sink is divided into eighteen small heat sinks by grooves formed in a rectangular lattice pattern. When the LED package is mounted on a mounting substrate, the gas generated from solder is efficiently discharged through the grooves to the outside, thereby suppressing the generation of air bubbles between the heat sink and the solder.

Abstract: A light-emitting device includes a plurality of light-emitting elements mounted on a wiring board, and a plurality of wirings that are provided on the wiring board and each connect predetermined ones of the plurality of light-emitting elements in series. A central element-connection wiring has a longest wiring length among the plurality of wirings, and a voltage applied to a central element is a lowest one of voltages applied to the plurality of light-emitting elements. A closest one of the plurality of light-emitting elements to a center of an element mounting region of the wiring board is defined as the central element, and a wiring that connects in series the central element is defined as the central element-connection wiring.

Abstract: A light emitting device includes: a heat dissipative board; a wiring board which adheres and is fixed to the heat dissipative board and in which a through-hole is formed; a light-emitting element which is mounted on a front surface of the heat dissipative board which is exposed through the through-hole of the wiring board; a bonding wire which connects the light-emitting element and the wiring board; and a light-reflecting member which covers a surface of an inner peripheral wall of the through-hole excluding disposition places of the light-emitting element and the bonding wire.

Abstract: A light-emitting device includes a first light-emitting element, a second light-emitting element, a third light-emitting element placed between the first and second light-emitting elements, and a bonding wire passing directly over the third light-emitting element and connecting the first light-emitting element with the second light-emitting element.

Abstract: A method for manufacturing a light emitting device includes providing a wafer including a substrate, a light emitting structure layer and a plurality of electrodes, forming a phosphor layer so as to cover a surface of the wafer on a side of the substrate, dividing the wafer and the phosphor layer so as to form a plurality of light emitting elements, measuring a luminescent chromaticity of the plurality of light emitting elements so as to classify into a first light emitting element having a luminescent chromaticity within a required chromaticity range and a second light emitting element having a luminescent chromaticity outside the required chromaticity range, and forming a second light emitting device that includes the plurality ones of the second light emitting element and the luminescent chromaticity within the required chromaticity range by using the second light emitting element.

Abstract: A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element.

Abstract: A light emitting device includes a substrate that has a circular light emitting region thereon, and a plurality of light emitting elements that is mounted on the light emitting region. The light emitting elements are arranged in a matrix shape of multiple rows and multiple columns. At least one of the rows or the columns is arranged so as to follow an outer end of the circular light emitting region and to deviate from virtual straight lines of the rows or the columns.

Abstract: A light emitting device includes: a heat dissipative board; a wiring board which adheres and is fixed to the heat dissipative board and in which a through-hole is formed; a light-emitting element which is mounted on a front surface of the heat dissipative board which is exposed through the through-hole of the wiring board; a bonding wire which connects the light-emitting element and the wiring board; and a light-reflecting member which covers a surface of an inner peripheral wall of the through-hole excluding disposition places of the light-emitting element and the bonding wire.

Abstract: A light emitting device includes a plurality of LED strings connected in parallel, wherein: each of the LED strings includes a plurality of LED chips connected in series to each other; in the LED string, ultraviolet light LED chips and blue LED chips or violet LED chips and blue LED chips are connected in series to each other; and the number of the ultraviolet light LED chips or the number of the violet LED chips is the same as the number of the blue LED chips in each of the plurality of LED strings.

Abstract: A light-emitting device includes a base material having a conductor layer on a surface thereof, the conductor layer being configured to be connected to an external power source, a light-emitting element mounted on the base, a phosphor layer arranged above the light-emitting element, and a resin layer contacting both of the phosphor layer and the conductor layer and containing heat-conductive particles dispersed therein. The heat-conductive particles have a thermal conductivity of not less than 100 W/m·K and an insulator property or a semiconductor property.

Abstract: A light-emitting device includes a substrate having a metal film on a first surface, a light-emitting element mounted on the first surface of the substrate and connected to the metal film, a heat sensitive circuit breaker mounted on the first surface of the substrate and connected to the metal film, a light-proof cover that covers the heat sensitive circuit breaker to block light emitted from the light-emitting element and travelling toward the heat sensitive circuit breaker, and a heat dissipating member formed on a second surface of the substrate to dissipate heat of the substrate, the second surface being opposite to the first surface.

Abstract: A light emitting device includes a plurality of light emitting elements. A difference between a maximum value and a minimum value of an inherent threshold voltage of the plurality of light emitting elements is not less than 0.5 V. A difference between a maximum value and a minimum value of a threshold voltage of the plurality of light emitting elements is not more than 0.1 V when temperature of the light emitting device is stabilized in operation.

Abstract: A method for manufacturing a light emitting device includes providing a wafer including a substrate, a light emitting structure layer and a plurality of electrodes, forming a phosphor layer so as to cover a surface of the wafer on a side of the substrate, dividing the wafer and the phosphor layer so as to form a plurality of light emitting elements, measuring a luminescent chromaticity of the plurality of light emitting elements so as to classify into a first light emitting element having a luminescent chromaticity within a required chromaticity range and a second light emitting element having a luminescent chromaticity outside the required chromaticity range, and forming a second light emitting device that includes the plurality ones of the second light emitting element and the luminescent chromaticity within the required chromaticity range by using the second light emitting element.

Abstract: A light-emitting device includes a substrate, a first light-emitting element mounted on the substrate, an annular transparent dam formed on the substrate so as to surround the first light-emitting element, a second light-emitting element that is mounted on the substrate so as to be embedded in an interior of the dam and that has a shorter peak emission wavelength than that of the first light-emitting element, and a sealing material filled inside the dam so as to seal the first light-emitting element.

Abstract: A light-emitting device includes a first light-emitting element, a second light-emitting element, a third light-emitting element placed between the first and second light-emitting elements, and a bonding wire passing directly over the third light-emitting element and connecting the first light-emitting element with the second light-emitting element.

Abstract: A light-emitting device includes a thermally conductive substrate, a wiring electrode formed on the thermally conductive substrate, a resist formed on the wiring electrode except a terminal thereof, and a light-emitting element that is disposed in an element mounting region of the thermally conductive substrate and electrically connected to the terminal of the wiring electrode. A heat dissipation hole is formed in a region of the resist outside the element mounting region so as to expose a surface of the thermally conductive substrate.

Abstract: A light emitting device includes a substrate that has a circular light emitting region thereon, and a plurality of light emitting elements that is mounted on the light emitting region. The light emitting elements are arranged in a matrix shape of multiple rows and multiple columns. At least one of the rows or the columns is arranged so as to follow an outer end of the circular light emitting region and to deviate from virtual straight lines of the rows or the columns.

Abstract: A light-emitting device includes a sheet-shaped die bonding material on a substrate including a wiring, and a plurality of light-emitting elements fixed onto the die bonding material. A method of manufacturing the light-emitting device includes applying the die bonding material in a paste form to the substrate such that the die bonding material is shared by the plurality of light-emitting elements, placing the plurality of light-emitting elements on the die bonding material in the paste form, and curing the die bonding material after placing the plurality of light-emitting elements so as to fix the plurality of light-emitting elements onto the bonding material.