Patents by Inventor Shota SUGIYAMA

Shota SUGIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240068600
    Abstract: A multi-cylindrical structure supply pipe includes at least three concentric pipes that couple a stationary fuel cell system that is stationary and an in-vehicle fuel cell system mounted on a fuel cell vehicle. The at least three concentric pipes include a hydrogen supply pipe, a liquid circulation pipe, and an electric wire pipe. The hydrogen supply pipe is configured to allow hydrogen gas to flow through the hydrogen supply pipe. The liquid circulation pipe surrounds an outer periphery of the hydrogen supply pipe. The liquid circulation pipe is configured to allow liquid to flow through the liquid circulation pipe outside the hydrogen supply pipe. The electric wire pipe surrounds an outer periphery of the liquid circulation pipe. The electric wire pipe is provided with one or more electric wires outside the liquid circulation pipe.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 29, 2024
    Inventors: Shota SUGIYAMA, Pei PEI
  • Patent number: 11845865
    Abstract: The present disclosure provides a base film for an adhesive tape used in a manufacturing process of a semiconductor that can be used in a plurality of processes including a reflow process. A thermoplastic resin film, which is a resin composite of a first resin component that is a crystalline thermoplastic resin having a melting point of 290° C. or higher and a second resin component that has a glass transition temperature of 150° C. or higher, wherein the crystallinity of the first resin component is more than 5.0% of the entire resin composite.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: December 19, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Takumi Asanuma, Hideyuki Ikeda, Shota Sugiyama
  • Publication number: 20210061998
    Abstract: The present disclosure provides a base film for an adhesive tape used in a manufacturing process of a semiconductor that can be used in a plurality of processes including a reflow process. A thermoplastic resin film, which is a resin composite of a first resin component that is a crystalline thermoplastic resin having a melting point of 290° C. or higher and a second resin component that has a glass transition temperature of 150° C. or higher, wherein the crystallinity of the first resin component is more than 5.0% of the entire resin composite.
    Type: Application
    Filed: November 11, 2020
    Publication date: March 4, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Takumi ASANUMA, Hideyuki IKEDA, Shota SUGIYAMA
  • Publication number: 20200039023
    Abstract: An object of the present disclosure is to provide an abrasive pad that is superior in abrading performance and abrasive slurry discharging properties. An abrasive pad having an abrading part and a groove part on an abrasive surface is provided in which a surface of the groove part has a non-foamed part, and a foamed part is exposed on a surface of the abrading part.
    Type: Application
    Filed: September 27, 2019
    Publication date: February 6, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Nobutoshi YOKOTA, Shota SUGIYAMA, Takashi NARIMATSU