Patents by Inventor Shota TATSUMI

Shota TATSUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250007266
    Abstract: A busbar assembly of the present invention includes a plurality of busbars disposed in parallel in a common plane with a gap between adjacent busbars, and an insulative resin layer including a gap filling part and a first surface-side laminate part, the first surface-side laminate part having a plurality of first surface-side center openings that expose predetermined parts of first surfaces of the plurality of busbars respectively to form a plurality of exposure regions, the insulative resin layer being formed by an insulative resin material that is transparent in a half-cured state and nontransparent in a completely cured state.
    Type: Application
    Filed: September 13, 2024
    Publication date: January 2, 2025
    Inventor: Shota TATSUMI
  • Patent number: 12126158
    Abstract: A busbar assembly of the present invention includes a plurality of busbars disposed in parallel in a common plane with a gap between adjacent busbars, and an insulative resin layer including a gap filling part and a first surface-side laminate part, the first surface-side laminate part having a plurality of first surface-side center openings that expose predetermined parts of first surfaces of the plurality of busbars respectively to form a plurality of exposure regions, the insulative resin layer being formed by an insulative resin material that is transparent in a half-cured state and nontransparent in a completely cured state.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: October 22, 2024
    Assignee: Suncall Corporation
    Inventor: Shota Tatsumi
  • Publication number: 20230378736
    Abstract: According to a manufacturing method of the present invention, it is possible to manufacture a busbar assembly in an efficient manner, the busbar assembly including busbars disposed in parallel in a common plane and an insulative resin layer including a gap filling portion filled into a gap between the adjacent busbars and a bottom-surface-side laminated portion extending integrally from the gap filling portion and arranged on bottom surfaces of the busbars, a top surface of the busbar being at least partially exposed to form a top-surface-side connection portion, the bottom surface of the busbar including a first bottom surface region which is located at the same position in a thickness direction as a lower end portion of the gap and on which the bottom-surface-side laminated portion is arranged and a second bottom surface region located farther away from the top surface than the first bottom surface region and exposed to the outside to form a bottom-surface-side connection portion.
    Type: Application
    Filed: September 24, 2021
    Publication date: November 23, 2023
    Inventors: Shota TATSUMI, Yuusuke ADACHI
  • Publication number: 20220239086
    Abstract: A busbar assembly of the present invention includes a plurality of busbars disposed in parallel in a common plane with a gap between adjacent busbars, and an insulative resin layer including a gap filling part and a first surface-side laminate part, the first surface-side laminate part having a plurality of first surface-side center openings that expose predetermined parts of first surfaces of the plurality of busbars respectively to form a plurality of exposure regions, the insulative resin layer being formed by an insulative resin material that is transparent in a half-cured state and nontransparent in a completely cured state.
    Type: Application
    Filed: June 12, 2020
    Publication date: July 28, 2022
    Inventor: Shota TATSUMI