Abstract: This power conversion device includes: a power module unit; and a capacitor module including a capacitor element, and a capacitor busbar. The capacitor busbar has a flat-plate portion, a plurality of power terminal connection portions, a power supply connection portion, and a plurality of element connection portions. An element-connection-portion position range which is a position range in a first direction between two element connection portions located at both ends, and a power-terminal-connection-portion position range which is a position range in the first direction between two power terminal connection portions located at both ends, are within a position range in the first direction where the flat-plate portion is located. A length of the element-connection-portion position range and a length of the power-terminal-connection-portion position range are equivalent to each other.

Abstract: [Subject] The aim is to eliminate the influence on a component mounting surface by burrs and contamination which are produced at the time of metal joining, and to obtain the semiconductor device which can achieve cooling of a power semiconductor at a small size and at a low cost. [Solution] A semiconductor device, includes: a power semiconductor, a heat sink, having a first surface on which the power semiconductor is provided, and a second surface on which a heat dissipation portion is provided, and a case, made of metal, in which the power semiconductor and the heat sink are stored, wherein, penetrating the case, metal joining between the case and the heat sink is performed.

Abstract: An object is to provide a power conversion device that enables a capacitor element to be efficiently cooled, thus suppressing deterioration of the capacitor element due to heat. The power conversion device includes: a power module including a module body portion storing a semiconductor element, and a power terminal protruding from the module body portion; a capacitor module including a capacitor body portion storing a capacitor element, and a capacitor busbar protruding from the capacitor body portion and connected to the power terminal; and a housing storing the power module and the capacitor module. The housing has a first surface to which the power module is thermally connected, and a second surface to which the capacitor module is thermally connected. A coolant path for cooling the first surface is provided on a back side of the first surface. The capacitor busbar is thermally connected to the first surface.

Abstract: The power conversion device includes: a power module having a shape of a rectangular parallelepiped; a cooling plate; and a cooler. The cooler includes: a cooling flow path through which a coolant flows; a first flow path hole extending from a third side surface side to a fourth side surface side; a second flow path hole extending from the third side surface side to the fourth side surface side; a first coupling portion coupling the cooling flow path and the first flow path hole; and a second coupling portion coupling the cooling flow path and the second flow path hole. The power module and each of at least a part of the first flow path hole and at least a part of the second flow path hole are located to overlap with each other as seen in a direction perpendicular to another surface of the cooling plate.

Abstract: In a power conversion device, a casing main body has a component mounting surface, on which electrical components are mounted, and a refrigerant flow passage surface, which is a back side of the component mounting surface. The refrigerant flow passage surface has a refrigerant flow passage groove. The component mounting surface has a first facing portion, which faces a lid, a second facing portion, which is adjacent to the first facing portion, and faces the lid farther away from the lid than the first facing portion, and aside surface portion, which is formed between the first facing portion and the second facing portion. The refrigerant flow passage groove has a first flow passage portion located on back sides of the first facing portion and the side surface portion, and a second flow passage portion located on a back side of the second facing portion.

Abstract: In a power conversion device, a casing main body has a component mounting surface, on which electrical components are mounted, and a refrigerant flow passage surface, which is a back side of the component mounting surface. The refrigerant flow passage surface has a refrigerant flow passage groove. The component mounting surface has a first facing portion, which faces a lid, a second facing portion, which is adjacent to the first facing portion, and faces the lid farther away from the lid than the first facing portion, and aside surface portion, which is formed between the first facing portion and the second facing portion. The refrigerant flow passage groove has a first flow passage portion located on back sides of the first facing portion and the side surface portion, and a second flow passage portion located on a back side of the second facing portion.