Abstract: This invention is concerning a structure body containing inorganic particles having an average particle diameter of 6 mm to 50 mm, and 6 parts by mass to 40 parts by mass of a resin with respect to 100 parts by mass of the inorganic particles.

Abstract: This invention is concerning a structure body containing inorganic particles having an average particle diameter of 6 mm to 50 mm, and 6 parts by mass to 40 parts by mass of a resin with respect to 100 parts by mass of the inorganic particles.

Abstract: The present invention is an unsaturated polyester resin composition comprising an unsaturated polyester (a), a monomer (b) having one polymerizable carbon-carbon double bond, a monomer (c) having two or more of (meth)acrylate groups, a filler (d) having high thermal conductivity, a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 75:25 and the unsaturated polyester resin composition comprises 400 to 1400 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). This unsaturated polyester resin composition has excellent curing properties without losing storage stability which can be used to provide a cured product having a low mold shrinkage ratio and high thermal conductivity.

Abstract: A thermosetting resin composition containing a polyfunctional (meth)acrylate (a), a high-thermal-conductivity filler (b) having a thermal conductivity of 20 to 250 W/m·K, a curing agent (c), and a copolymer (d) having an acid group containing phosphoric acid, wherein the amount of the high-thermal-conductivity filler (b) is from 1600 to 2100 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a), and the amount of the copolymer (d) having an acid group containing phosphoric acid is from 7.5 to 30 parts by mass per 100 parts by mass of the polyfunctional (meth)acrylate (a).

Abstract: The present invention is an unsaturated polyester resin composition comprising an unsaturated polyester (a), a monomer (b) having one polymerizable carbon-carbon double bond, a monomer (c) having two or more of (meth)acrylate groups, a filler (d) having high thermal conductivity, a glass fiber (e), a low profile additive (f), a curing agent (g), and a polymerization inhibitor (h), wherein the ratio by weight of the ingredient (b) to the ingredient (c) is from 50:50 to 75:25 and the unsaturated polyester resin composition comprises 400 to 1400 parts by weight of the ingredient (d) based on the total 100 parts by weight of the ingredients (a), (b), and (c). This unsaturated polyester resin composition has excellent curing properties without losing storage stability which can be used to provide a cured product having a low mold shrinkage ratio and high thermal conductivity.

Abstract: A packaging container comprises an openable outer case and a bag for packaging a resin material in the outer case. The bag is partially turned back at fold portions so that part of the bag is turned inside out, and at least part of the out-turned part is fixed as a fixing part to any part other than the bag. The inner surfaces of the bag at the fold portions are placed in contact with each other, forming a contact portion, to seal the resin material. The contact portion is placed in correspondence with an openable part of an opening flap of the outer case.

Abstract: A packaging container comprises an openable outer case and a bag for packaging a resin material in the outer case. The bag is partially turned back at fold portions so that part of the bag is turned inside out, and at least part of the out-turned part is fixed as a fixing part to any part other than the bag. The inner surfaces of the bag at the fold portions are placed in contact with each other, forming a contact portion, to seal the resin material. The contact portion is placed in correspondence with an openable part of an opening flap of the outer case.

Abstract: An object of the present invention is to obtain low specific gravity unsaturated polyester resin compositions for lamp reflectors and molded articles thereof, which have a low and invariant specific gravity, and excellent surface smoothness, heat resistance, rigidity, dimensional accuracy, moldability, etc. The compositions comprise from 40 to 210 parts by weight of an inorganic filler having an average particle size of at least 0.5 ?m and from 30 to 160 parts by weight of a hollow filler having a pressure resistance of at least 2,100×104 N/m2 of based on 100 parts by weight of an unsaturated polyester resin and a crosslinking agent wherein the addition ratio by weight of the inorganic filler to the hollow filler lies within a range of 2:8 to 8:2.