Abstract: A grasping device of the embodiment includes claw holding parts, a cam, pins, a motor, and a rail holding part. The claw holding parts are supported by rails in a slidable manner. The cam includes grooves or curved holes having a spiral shape provided around the rotation center and a hole provided at the rotation center. The pins each have one end engaged with the claw holding parts side and the other end engaged with the grooves or the curved holes of the cam. The motor includes a shaft to be fixed to the hole of the cam. The rail holding part is configured to hold the rails and engage a positioning jig with an end portion of the shaft at the side fixed to the cam and including a hole part with an inner peripheral surface where the outer peripheral surface of the jig is contactable.

Abstract: A grasping device of the embodiment includes claw holding parts, a cam and pins. The claw holding parts are supported by rails in a slidable manner. The cam includes grooves or curved holes having a spiral shape provided around a rotation center and is formed of a sintered material. The pins each have one end engaged with the claw holding parts side and the other end engaged with the grooves or the curved holes of the cam.

Abstract: A camera module is configured to capture an optical image of a target area and includes a lens member, an imager, a light transmitting member, and a seat. The lens member is configured to receive light from the target area. The imager has a curved portion convex in a direction away from the lens member and is configured to capture the optical image formed on the curved portion. The light transmitting member optically couples the lens member and the imager. The seat has a supporting portion that supports an outer rim of the imager and a fluid space defined inside the supporting portion. A heat dissipation fluid undergoes convection in the fluid space. The curved portion is interposed between the light transmitting member and the seat having the supporting portion and the fluid space.

Abstract: There is provided a load detector including, a beam-type load cell which is supported on a support base in a cantilever manner; and a placement part which is connected to the beam-type load cell. The placement part includes a placement plate onto which a subject is to be placed, and a slope which is configured to guide the subject from a floor surface onto the placement plate. A forward end of the slope is swingable about a first perpendicular axis perpendicular to the placement plate or a second perpendicular axis perpendicular to the slope, and/or is movable in a width direction of the placement plate.

Abstract: There is provided a load detector including, a beam-type load cell which is supported on a support base in a cantilever manner; and a placement part which is connected to the beam-type load cell. The placement part includes a placement plate onto which a subject is to be placed, and a slope which is configured to guide the subject from a floor surface onto the placement plate. A forward end of the slope is swingable about a first perpendicular axis perpendicular to the placement plate or a second perpendicular axis perpendicular to the slope, and/or is movable in a width direction of the placement plate.

Abstract: Electrode pads disposed on a first surface of a semiconductor element include a first pad located close to a corner and a second pad located apart from the corner compared with the first pad. A first wire connected to the first pad has a smaller Young's modulus than a second wire connected to the second pad. A thickness of an intermetallic compound layer formed by the first wire and the first pad is larger than a thickness of an intermetallic compound layer formed by the second wire and the second pad.

Abstract: Electrode pads disposed on a first surface of a semiconductor element include a first pad located close to a corner and a second pad located apart from the corner compared with the first pad. A first wire connected to the first pad has a smaller Young's modulus than a second wire connected to the second pad. A thickness of an intermetallic compound layer formed by the first wire and the first pad is larger than a thickness of an intermetallic compound layer formed by the second wire and the second pad.

Abstract: An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.

Abstract: An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.