Abstract: An image sensor includes an imaging element for imaging an object, a movable member mounted with the imaging element and movably provided, a flexible printed circuit board having a portion on a side of a first end connected to the imaging element, and including a visually recognizable positioning member provided at least on a side of an upper surface and an extension/contraction region formed by folding the flexible printed circuit board with reference to the positioning member, and a circuit board connected with a portion on a side of a second end of the flexible printed circuit board and fixedly set.

Abstract: An image sensor includes an imaging element for imaging an object, a movable member mounted with the imaging element and movably provided, a flexible printed circuit board having a portion on a side of a first end connected to the imaging element, and including a visually recognizable positioning member provided at least on a side of an upper surface and an extension/contraction region formed by folding the flexible printed circuit board with reference to the positioning member, and a circuit board connected with a portion on a side of a second end of the flexible printed circuit board and fixedly set.

Abstract: In an image forming apparatus including a thermal head attached to a supporting body having a heat release function, a power supply circuit board that is disposed inside a casing and supplies electrical power to the thermal head, and a cooling fan that takes in the outside air for cooling the thermal head and the power supply circuit board, on the substrate of the power supply circuit board near the cooling fan provided on the side wall of the casing, a pair of heat sinks that guide cooling air from the cooling fan to the thermal head are implanted opposite each other by being spaced from the thermal head.

Abstract: In a laser beam printer, an elastic conductive member is disposed between a rotating axis of a transfer roller and a land portion of a power supply circuit board and the transfer roller is electrically connected to the power supply circuit board through the elastic conductive member. A front end portion of the elastic conductive member is pressed onto the land portion by its elastic force to come into contact with a solder pad formed on the surface of the land portion for electrical connection. A resist film is partially formed on the surface of the land portion and the solder pad is formed on the region on the land portion that is not covered with the resist film. Thus, a large contact area between the front end portion of the elastic conductive member and the solder pad is ensured so as to address a high voltage applied to the transfer roller. As a result, the transfer roller, etc. can be electrically connected to the power supply circuit board with certainty without increasing the number of components.

Abstract: In a laser beam printer, an elastic conductive member is disposed between a rotating axis of a transfer roller and a land portion of a power supply circuit board and the transfer roller is electrically connected to the power supply circuit board through the elastic conductive member. A front end portion of the elastic conductive member is pressed onto the land portion by its elastic force to come into contact with a soldering pad formed on the surface of the land portion for electrical connection. A resist film is partially formed on the surface of the land portion and the soldering pad is formed on the region on the land portion that is not covered with the resist film. Thus, a large contact area between the front end portion of the elastic conductive member and the soldering pad is ensured so as to address a high voltage applied to the transfer roller. As a result, the transfer roller, etc.

Abstract: In an image forming apparatus including a thermal head attached to a supporting body having a heat release function, a power supply circuit board that is disposed inside a casing and supplies electrical power to the thermal head, and a cooling fan that takes in the outside air for cooling the thermal head and the power supply circuit board, on the substrate of the power supply circuit board near the cooling fan provided on the side wall of the casing, a pair of heat sinks that guide cooling air from the cooling fan to the thermal head are implanted opposite each other by being spaced from the thermal head.