Patents by Inventor SHOU-CHI TSENG

SHOU-CHI TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • [ELECTROPLATING APPARATUS]
    Publication number: 20050067274
    Abstract: The present invention provides an electroplating apparatus that provides a turbulent current and an even fluid flow pressure of a plating solution for uniformly distributing the flow of the plating solution over a wafer. By using the electroplating apparatus of the present invention, a metal can be grown uniformly in a via hole, and a metal layer can be uniformly formed on the wafer. Therefore, non-uniformly formed metal layer and partially filled via holes can be effectively avoided.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventors: SHAO-YU TING, SHIH-FENG CHEN, WEI-PIN JAO, SHOU-CHI TSENG, YUAN-CHIH HSIEH