Patents by Inventor Shou De Zhen

Shou De Zhen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature triggering ejector mechanism for lock pin soldering type component
    Patent number: 9314861
    Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: April 19, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Xiaowei Huang, Ke Pu, WeiFeng Zhang, Shou De Zhen
  • Temperature Triggering Ejector Mechanism for Lock Pin Soldering Type Component
    Publication number: 20140353360
    Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.
    Type: Application
    Filed: May 23, 2014
    Publication date: December 4, 2014
    Applicant: International Business Machines Corporation
    Inventors: Xiaowei Huang, Ke Pu, WeiFeng Zhang, Shou De Zhen