Patents by Inventor Shou H. Chen

Shou H. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding surface and bonding method
    Patent number: 6265300
    Abstract: A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
    Type: Grant
    Filed: November 18, 1993
    Date of Patent: July 24, 2001
    Assignee: Intel Corporation
    Inventors: Ameet S. Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger, Ching C. Lee, Kevin Jeng
  • Bonding pad structure having an interposed rigid layer
    Patent number: 5567981
    Abstract: A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: October 22, 1996
    Assignee: Intel Corporation
    Inventors: Ameet S. Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger, Ching C. Lee, Kevin Jeng
  • Process for manufacturing rare earth-iron-boron permanent magnet alloy powders
    Patent number: 5183494
    Abstract: A process for producing rare earth-iron-boron permanent magnet alloy powders comprising; heating pellets comprising a mixture of rare earth oxides, iron power, ferroboron powder and calcium grandules for reaction/diffusion to obtain a rare earth-iron-boron alloy of uniform composition, crushing the resulting alloy to form a powder and contacting the powder with an aqueous solution of acetic acid containing a non-ionic surfactant and an alkai metal acetate.
    Type: Grant
    Filed: April 23, 1991
    Date of Patent: February 2, 1993
    Assignee: Industrial Technology Research Instiute
    Inventors: Ti Y. Liu, Chi J. Chen, Shou H. Chen
  • Process for applying electrically insulative layers
    Patent number: 4927664
    Abstract: A process for applying an electrically insulative layer on a metal surface which comprising suspending an electrically insulative powder in a highly volatile solvent by ultrasonic vibration to give a suspension, applying said suspension on the surface of said metal surface, and then evaporating said solvent, leaving an electrically insulative layer consisting of said insulative powder.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: May 22, 1990
    Assignee: Industrial Technology Research Institute
    Inventors: Chong S. Tsai, Shou H. Chen, Bean T. Li, King L. Jean