Patents by Inventor SHOU-NENG TO

SHOU-NENG TO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION AND METAL CLAD SUBSTRATE
    Publication number: 20240002653
    Abstract: A resin composition and a metal clad substrate are provided. The resin composition includes: 5 phr to 15 phr of a maleimide resin, 5 phr to 30 phr of a benzoxazine resin, 40 phr to 70 phr of an epoxy resin, and 40 phr to 60 phr of fillers. An amount of fluorine atoms contained in the maleimide resin ranges from 10 wt % to 50 wt %.
    Type: Application
    Filed: May 8, 2023
    Publication date: January 4, 2024
    Inventors: SHENG-YEN WU, SHOU-NENG TO, YA-PING LIU, CHEN-HAO CHANG, PEI-CHUN LAI