Abstract: A method of multi-site testing a batch of semiconductor units using a multi-site automated tester (100). The tester (300) includes a handler (320) coupled to a contactor (330) including a first plurality of contact sites. The method includes the step of loading the first plurality of units into the first plurality of contact sites (201). The first plurality of units are simultaneously tested (202) using a test program to determine bin information for each of the first plurality of units, wherein the bin information defines each of the first plurality units as being a passed unit or a reject unit. The passed units are offloaded from respective contact sites of the first plurality of contact sites to create vacant contact sites (203), while keeping the reject unit(s) at respective contact sites of the first plurality of contact sites. Untested units from the batch are then loaded to fill the vacant contact sites (204).

Abstract: A method of multi-site testing a batch of semiconductor units using a multi-site automated tester (100). The tester (300) includes a handler (320) coupled to a contactor (330) including a first plurality of contact sites. The method includes the step of loading the first plurality of units into the first plurality of contact sites (201). The first plurality of units are simultaneously tested (202) using a test program to determine bin information for each of the first plurality of units, wherein the bin information defines each of the first plurality units as being a passed unit or a reject unit. The passed units are offloaded from respective contact sites of the first plurality of contact sites to create vacant contact sites (203), while keeping the reject unit(s) at respective contact sites of the first plurality of contact sites. Untested units from the batch are then loaded to fill the vacant contact sites (204).

Abstract: An apparatus for mitigating condensation formation on a device interface board during low-temperature semiconductor device testing includes a nozzle. The nozzle includes an input orifice for receiving gas from a gas source and at least one output orifice for discharging gas from the nozzle against a surface of the device interface board. The area of the at least one output orifice is substantially greater than the area of input orifice.