Patents by Inventor Shou-yi HO

Shou-yi HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230201975
    Abstract: A solder ball with a concave-convex structure is provided. The solder ball with a concave-convex structure includes tin-bismuth alloy including a plurality of concave portions and convex portions on its surface. The height difference between the concave portions and the convex portions is between about 10 nanometers and about 200 nanometers. The proportion of tin in the tin-bismuth alloy is between about 28% and about 52%. A method for preparing the solder ball with a concave-convex structure is also provided.
    Type: Application
    Filed: May 16, 2022
    Publication date: June 29, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shou-Yi HO, Jyh-Long JENG
  • Patent number: 11437162
    Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: September 6, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Xuan Lai, Shou-Yi Ho, Yi-Chi Yang, Yen-Chun Liu
  • Publication number: 20210376375
    Abstract: Provided are a lithium ion battery, an electrode of a lithium ion battery, and an electrode material. An electrode material of the lithium ion battery includes electrode active powder and a metal thin film. The metal thin film partially or completely wraps a surface of the electrode active powder, in which the metal thin film includes silver, gold, platinum, palladium, aluminum, magnesium, zinc, tin, or an alloy of the foregoing.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Han Lin, Shou-Yi Ho, Hung-Chun Wu, Jing-Pin Pan, Sheng-Wei Kuo, Kuo-Chan Chiou, Ying-Xuan Lai
  • Publication number: 20210202126
    Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 1, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Xuan LAI, Shou-Yi HO, Yi-Chi YANG, Yen-Chun LIU
  • Patent number: 11016385
    Abstract: The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 25, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Yi-Chi Yang, Shou-Yi Ho, Kuo-Chan Chiou
  • Publication number: 20210104339
    Abstract: A conductive composition and a method for fabricating a micro light-emitting diode (LED) display are provided. The conductive composition includes 5-90 parts by weight of monomer, 10-95 parts by weight of epoxy resin, and 50-150 parts by weight of conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, wherein n is 1, 2, 3 or 4. The monomer has a molecular weight equal to or less than 350. The epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq. Furthermore, there is a specific relationship among the weight of monomer, the number of reactive functional groups, the molecular weight of monomer, the weight of epoxy resin, and the epoxy equivalent weight of epoxy resin.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 8, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shou-Yi HO, Yen-Chun LIU, Kuo-Chan CHIOU, Hsien-Kuang LIN
  • Patent number: 10954329
    Abstract: A modified copolymer is provided. The modified copolymer includes a random copolymer of a repeat unit of formula (I) and a repeat unit of formula (II) wherein M is derived from monomers with double bonds, R is a direct bond or an aliphatic hydrocarbon chain group having 1 to 12 carbon atoms, a cyclic aliphatic hydrocarbon group having 3 to 16 carbon atoms, an alkylcarbonyloxy group having 2 to 6 carbon atoms, a carbonyl group, an ether group, an ester group, an amide group, an aromatic group having 6 to 16 carbon atoms, or a divalent group having any of the above groups, wherein m and x are positive integers less than 50. The weight average molecular weight of the modified copolymer is between 3000 and 30000.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: March 23, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shou-Yi Ho, Kuo-Chan Chiou
  • Publication number: 20200095357
    Abstract: A modified copolymer is provided. The modified copolymer includes a random copolymer of a repeat unit of formula (I) and a repeat unit of formula (II) wherein M is derived from monomers with double bonds, R is a direct bond or an aliphatic hydrocarbon chain group having 1 to 12 carbon atoms, a cyclic aliphatic hydrocarbon group having 3 to 16 carbon atoms, an alkylcarbonyloxy group having 2 to 6 carbon atoms, a carbonyl group, an ether group, an ester group, an amide group, an aromatic group having 6 to 16 carbon atoms, or a divalent group having any of the above groups, wherein m and x are positive integers less than 50. The weight average molecular weight of the modified copolymer is between 3000 and 30000.
    Type: Application
    Filed: December 26, 2018
    Publication date: March 26, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shou-Yi HO, Kuo-Chan CHIOU
  • Publication number: 20200064736
    Abstract: The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.
    Type: Application
    Filed: December 19, 2018
    Publication date: February 27, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Yi-Chi Yang, Shou-Yi Ho, Kuo-Chan Chiou
  • Publication number: 20170145247
    Abstract: A packaging composition and packaging structure employing the same are disclosed. The packaging composition includes: (a) 30-70 parts by weight of free radical polymerizable monomer, and (b) 30-70 parts by weight of prepolymer. In particular, the oligomer is a reaction product of polythiol compound and polyester oligomer having acrylate functional group.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 25, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shou-yi HO, Kuo-Chan CHIOU