Abstract: Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

Abstract: An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 ?m, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.

Abstract: An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.

Abstract: A silicone adhesive having (A) an organopolysiloxane partial condensate of (i) a diorganopolysiloxane end-capped with a hydroxyl radical and (ii) an organopolysiloxane copolymer having hydroxyl radicals and having R33SiO1/2 units and SiO4/2 units wherein R3 is hydroxyl or a monovalent hydrocarbon radical, (B) a silane or siloxane compound having a silicon atom-bonded alkoxy radical and/or an epoxy radical, and (C) a crosslinking agent exhibits pressure-sensitive adhesion and permanent adhesion.

Abstract: Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

Abstract: A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.

Abstract: A dicing and die bonding tape, comprising a substrate 1, a pressure sensitive adhesive layer (A) 2 superimposed on the substrate 1, a substrate 3 superimposed on the pressure sensitive adhesive layer (A) 2, a pressure sensitive adhesive layer (B) 4 superimposed on the substrate 3, and an adhesive layer 5 super imposed on the pressure sensitive adhesive layer (B) 4, said dicing and die bonding tape having an adhesion strength between the pressure sensitive adhesive layer (A) 2 and a dicing flame of 0.6 N/25 mm or larger, and an adhesion strength between the pressure sensitive adhesive layer (B) 4 and the adhesive layer 5 of from 0.05 to 0.5 N/25 mm.

Abstract: An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 ?m, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.

Abstract: A silicone adhesive comprises (A) a reaction mixture obtained by subjecting a partially condensed mixture of (i) a hydroxy-terminated diorganopolysiloxane and (ii) an organopolysiloxane copolymer having hydroxyl and alkenyl radicals and comprising R33SiO1/2 units and SiO2 units, and (iii) a silicon compound having a silicon atom-bonded hydrogen atom and a silicon atom-bonded alkoxy radical to addition reaction in the presence of a platinum catalyst and (B) a crosslinking agent. The silicone adhesive exhibits at the initial a tackiness sufficient to fixedly secure a substrate. By press bonding another substrate to the adhesive-bearing substrate and heating them, the substrates can be firmly bonded together.

Abstract: An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.

Abstract: A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2-2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.

Abstract: A silicone adhesive comprises (A) a reaction mixture obtained by subjecting a partially condensed mixture of (i) a hydroxy-terminated diorganopolysiloxane and (ii) an organopolysiloxane copolymer having hydroxyl and alkenyl radicals and comprising R33SiO1/2 units and SiO2 units, and (iii) a silicon compound having a silicon atom-bonded hydrogen atom and a silicon atom-bonded alkoxy radical to addition reaction in the presence of a platinum catalyst and (B) a crosslinking agent. The silicone adhesive exhibits at the initial a tackiness sufficient to fixedly secure a substrate. By press bonding another substrate to the adhesive-bearing substrate and heating them, the substrates can be firmly bonded together.

Abstract: A silicone adhesive comprising (A) an organopolysiloxane partial condensate of (i) a diorganopolysiloxane end-capped with a hydroxyl radical and (ii) an organopolysiloxane copolymer having hydroxyl radicals and consisting essentially of R33SiO1/2 units and SiO4/2 units wherein R3 is hydroxyl or a monovalent hydrocarbon radical, (B) a silane or siloxane compound having a silicon atom-bonded alkoxy radical and/or an epoxy radical, and (C) a crosslinking agent exhibits pressure-sensitive adhesion and permanent adhesion.

Abstract: In a coated optical fiber comprising a quartz glass fiber, a primary coating and a secondary coating, the secondary coating is formed by curing a resin composition comprising (A) 20-90 wt % of a polyurethane (meth)acrylate oligomer which is synthesized from an alicyclic polyisocyanate, contains 5-90 wt % of a polyurethane (meth)acrylate oligomer having a Mn of up to 1,000, and has an overall Mn of up to 10,000, and (B) 80-10 wt % of an ethylenically unsaturated compound, with electron beams accelerated at 50-125 kV. The coated optical fiber has a minimized transmission loss.

Abstract: A liquid radiation-curable resin composition comprising the reaction product obtained by reacting (A) a polyether having a (meth)acryloyl group and a hydroxyl group at opposite ends with (B) a diisocyanate having two isocyanate groups in a molar ratio from 1.8/1 to 2.2/1 has a low viscosity enough to coat on an optical fiber at a high speed. Upon curing, it forms a coating having a minimized water absorption on the optical fiber.

Abstract: In a coated optical fiber comprising a quartz glass fiber, a primary coating and a secondary coating, the secondary coating is formed by curing a resin composition comprising (A) 20-90 wt % of a polyurethane (meth)acrylate oligomer which is synthesized from an alicyclic polyisocyanate, contains 5-90 wt % of a polyurethane (meth)acrylate oligomer having a Mn of up to 1,000, and has an overall Mn of up to 10,000, and (B) 80-10 wt % of an ethylenically unsaturated compound, with electron beams accelerated at 50-125 kV. The coated optical fiber has a minimized transmission loss.

Abstract: In a coated optical fiber comprising a quartz glass fiber, a primary coating, and a secondary coating, the secondary coating is formed by curing a resin composition comprising (A) 20-90 wt % of polyurethane (meth)acrylate oligomer having a Mn of up to 20,000 and (B) 80-10 wt % of a mono-ethylenically unsaturated compound containing at least one N-vinyl compound, whose homopolymer has a Tg of at least 50° C., with electron beams accelerated at a low voltage of 50-125 kV. The coated optical fiber has a minimized transmission loss.

Abstract: A radiation-curable liquid resin composition contains (A) an organopolysiloxane having a (meth)acryl group at either end of its molecular chain, containing at least 15 mol % of aromatic hydrocarbon groups based on the entire organic groups, and being free of a urethane bond, (B) a compound having at least one ethylenically unsaturated group in a molecule, and (C) a photopolymerization catalyst. The composition has a low viscosity and cures into a product having a low Young's modulus and experiencing a less change of Young's modulus at low temperatures. The composition is useful as a primary coating for optical fibers.

Abstract: The invention provides a photocurable resin composition which inhibits the deactivation of a bisacylphosphine oxide-series photopolymerization initiator and is useful for coating optical fibers. The photocurable resin composition comprises (A) a polyurethane (meth)acrylate oligomer, (B) an ethylenically unsaturated compound, (C) a bisacylphosphine oxide-series photopolymerization initiator, and (D) a tertiary amine and no tin component. Incorporation of the component (D) inhibits the decomposition and deactivation of the component (C). The component (A) may contain an aliphatic C.sub.14-40 polyol (hydrogenated dimerdiol, 12-hydroxystearyl alcohol) as a polyol component. This resin composition is used for a primary coating of a glass fiber or an indirect coating of an optical fiber through the primary layer, the coating layer being cured by light irradiation to provide an optical fiber coated with the resin composition.

Abstract: In the coating composition for a optical fiber of the present invention, a polyurethane (meth)acrylate oligomer (A), which is based on a urethane prepolymer having an equivalent ratio of NCO group in a polyisocyanate (a) to OH group in a polyol (b) of more than 3.0, is used and the oligomer (A) has a mixing weight ratio of an oligomer (d) having a number average molecular weight of 800 or less to an oligomer (e) having a number average molecular weight of 1,000 or more of 30/70-70/30.The coating composition of this invention has a low viscosity, and therefore, is suitable for a rapid fiber-drawing in a production of an optical fiber. Further, a cured material obtained from the coating composition of the present invention has both a high elastic modulus and a high elongation, which properties are required for a hard material, and has a slight change of elastic modulus with a change of temperature to improve a long-term reliability of an optical fiber.