Abstract: Provided is a flat display device comprising an outer cabinet in a frame shape, wherein at least one side of a frame section of the outer cabinet includes a decorative bar, which is formed by sequentially laminating a second member transmitting light and a third member having a smaller refractive index than that of the second member on a first member having a reflecting surface to reflect light, and is provided with a light-emitting unit, which emits light, in a portion opposed to an end surface of the second member of the decorative bar.

Abstract: An injection mold 70 includes a first portion 71, a second portion 72, a third portion 73, and a fourth portion 79. The first portion 71 has three high-density regions H in which there is the highest proportion of the axial direction dimension accounted for by the portion corresponding to cam grooves with respect to the axial direction dimension of a cavity 71a. First gates 74b are disposed at locations corresponding to the high-density regions H, or closer to the high-density regions H than second gates 75b. The average channel sectional area of first runners 74a is larger than the average channel sectional area of second runners 75a.

Abstract: A drive frame 34 as a cylindrical molded article has a drive frame main body 34a, three first cam grooves 34c, three second cam grooves 34d, three high-density regions H, and three cam pins 43. The cam pins 43 are disposed in the circumferential direction between first center lines X1 which are positioned in the center in the circumferential direction between adjacent high-density regions H, and the high-density regions H.

Abstract: A drive frame 34 as a cylindrical molded article has a drive frame main body 34a, three first cam grooves 34c, three second cam grooves 34d, three high-density regions H, and three cam pins 43. The cam pins 43 are disposed in the circumferential direction between first center lines X1 which are positioned in the center in the circumferential direction between adjacent high-density regions H, and the high-density regions H.

Abstract: A drive frame 34 as a cylindrical molded article has a drive frame main body 34a, three first cam grooves 34c, three second cam grooves 34d, three high-density regions H, and three cam pins 43. The cam pins 43 are disposed in the circumferential direction between first center lines X1 which are positioned in the center in the circumferential direction between adjacent high-density regions H, and the high-density regions H.

Abstract: A drive frame 34 as a cylindrical molded article has a drive frame main body 34a, three first cam grooves 34c, three second cam grooves 34d, three high-density regions H, and three cam pins 43. The cam pins 43 are disposed in the circumferential direction between first center lines X1 which are positioned in the center in the circumferential direction between adjacent high-density regions H, and the high-density regions H.

Abstract: An injection mold 70 includes a first portion 71, a second portion 72, a third portion 73, and a fourth portion 79. The first portion 71 has three high-density regions H in which there is the highest proportion of the axial direction dimension accounted for by the portion corresponding to cam grooves with respect to the axial direction dimension of a cavity 71a. First gates 74b are disposed at locations corresponding to the high-density regions H, or closer to the high-density regions H than second gates 75b. The average channel sectional area of first runners 74a is larger than the average channel sectional area of second runners 75a.

Abstract: A plastic identifying method of the present invention is provided with a step (i) of obtaining a first infrared absorption spectrum by irradiating infrared light of a predetermined wave number onto an item to be identified that contains plastic and measuring the intensity of the infrared light that is totally reflected by this item, and a step (ii) of identifying the plastic contained in the item to be identified by matching the first infrared absorption spectrum with a group of infrared absorption spectra that have been measured for predetermined materials, wherein the predetermined materials are a group of materials containing plastics, and each infrared absorption spectrum in this group of infrared absorption spectra is obtained by irradiating infrared light of a predetermined wave number onto a predetermined material, and measuring the intensity of the infrared light that is totally reflected by that material, and matching is carried out by comparing peaks in the first infrared absorption spectrum with pe

Abstract: A metal identification device of the present invention is characterized in that it includes an arc discharge device including a discharge electrode for causing a discharge between itself and an object to be identified so as to excite the object to be identified and cause it to emit light, an optic fiber for gathering light that has been emitted by the arc discharge device, a spectrophotometer for measuring an emission spectrum of the light that has been gathered by the optic fiber, a personal computer serving as an identification processing portion for identifying a type of the object to be identified by comparing data of the emission spectrum measured by the spectrophotometer and emission spectrum data of a plurality of standard samples stored in advance, and a damage processing portion for damaging at least some of the surface of the object to be identified.

Abstract: A method for distinguishing a kind of plastic materials, by preparing a test piece of a plastic material; measuring an infrared spectrum of the test piece by attenuated total reflection spectroscopy; and comparing the obtained infrared spectrum with an infrared spectrum of a known plastic. The test piece has a section. The infrared spectrum of the test piece is measured by bringing the crystal for attenuated total reflection spectroscopy into contact with the section of the test piece.

Abstract: A plastic identifying method of the present invention is provided with a step (i) of obtaining a first infrared absorption spectrum by irradiating infrared light of a predetermined wave number onto an item to be identified that contains plastic and measuring the intensity of the infrared light that is totally reflected by this item, and a step (ii) of identifying the plastic contained in the item to be identified by matching the first infrared absorption spectrum with a group of infrared absorption spectra that have been measured for predetermined materials, wherein the predetermined materials are a group of materials containing plastics, and each infrared absorption spectrum in this group of infrared absorption spectra is obtained by irradiating infrared light of a predetermined wave number onto a predetermined material, and measuring the intensity of the infrared light that is totally reflected by that material, and matching is carried out by comparing peaks in the first infrared absorption spectrum with pe

Abstract: A method for distinguishing a kind of plastic materials, by preparing a test piece of a plastic material; measuring an infrared spectrum of the test piece by attenuated total reflection spectroscopy; and comparing the obtained infrared spectrum with an infrared spectrum of a known plastic. The test piece has a section. The infrared spectrum of the test piece is measured by bringing the crystal for attenuated total reflection spectroscopy into contact with the section of the test piece.

Abstract: A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

Abstract: An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.