Abstract: A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.

Abstract: A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.

Abstract: A processing system 10 applies an etching process on a wafer W in a PM1 or PM2. An EC 200 includes functions of a transfer/process control unit 250, a communication unit 255, a log management unit 260, and a backup unit 265, and controls the processing system 10. The transfer/process control unit 250 controls wafer transfer and the etching process. The communication unit 255 transmits to or receives data from each MC 300 and the like. The log management unit 260 registers log information generated at times of the wafer process and transfer, data communication, and the like in log files (in predetermined storage areas of an HDD 215). The backup unit 265 collectively saves the log information stored in the log files in backup files (in other storage areas of the HDD 215), in response to a timing when an unexpected alarm has been generated.

Abstract: A processing system 10 applies an etching process on a wafer W in a PM1 or PM2. An EC 200 includes functions of a transfer/process control unit 250, a communication unit 255, a log management unit 260, and a backup unit 265, and controls the processing system 10. The transfer/process control unit 250 controls wafer transfer and the etching process. The communication unit 255 transmits to or receives data from each MC 300 and the like. The log management unit 260 registers log information generated at times of the wafer process and transfer, data communication, and the like in log files (in predetermined storage areas of an HDD 215). The backup unit 265 collectively saves the log information stored in the log files in backup files (in other storage areas of the HDD 215), in response to a timing when an unexpected alarm has been generated.