Patents by Inventor Shouichirou NARUSE

Shouichirou NARUSE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE
    Publication number: 20230166363
    Abstract: A solder alloy includes 1.1% by mass or more and 8% by mass or less of Cu; 6% by mass or more and 20% by mass or less of Sb; 0.01% by mass or more and 0.5% by mass or less of Ni; and 0.001% by mass or more and 1% by mass or less of Co; a balance being Sn. An amount of Cu (% by mass) and an amount of Ni (% by mass) satisfies following formula: the amount of Ni/(the amount of Cu+the amount of Ni)<0.10.
    Type: Application
    Filed: September 9, 2022
    Publication date: June 1, 2023
    Applicant: TAMURA CORPORATION
    Inventors: Shouichirou NARUSE, Takeshi NAKANO, Isao SAKAMOTO, Toshiaki SHIMADA, Koichi OKUBO