Abstract: The present invention relates to a pressure-sensitive adhesive sheet for dicing, which comprises a substrate and at least one pressure-sensitive adhesive layer disposed on at least one surface of the substrate, the substrate containing polyvinyl chloride as a primary component and a trialkyl phosphite as a thermal stabilizer of the polyvinyl chloride, and the pressure-sensitive adhesive layer containing poly(meth)acrylic acid ester as a primary component, in which the trialkyl phosphite transited from the substrate into the pressure-sensitive adhesive layer is not unevenly distributed on a surface of the pressure-sensitive adhesive layer; a method of processing a processed material using the same, and a piece of a processed material obtainable by the method.

Abstract: An optical display unit manufacturing method includes subjecting a sheet material having curling properties to half cutting and bonding the cut piece of the sheet material to a substrate with an adhesive interposed therebetween, while peeling off the member left uncut and can solve the problem of peeling of the cut piece of the sheet material during feeding after the half cutting in such a process, so that the cut piece of the sheet material can be bonded to the substrate in a satisfactory manner.

Abstract: The present invention intends to provide a pressure-sensitive adhesive sheet for dicing which inhibits the generation of fibrous scraps and has good expandability.

Abstract: The present invention relates to a pressure-sensitive adhesive sheet for dicing, which comprises a substrate and at least one pressure-sensitive adhesive layer disposed on at least one surface of the substrate, the substrate containing polyvinyl chloride as a primary component and a trialkyl phosphite as a thermal stabilizer of the polyvinyl chloride, and the pressure-sensitive adhesive layer containing poly(meth)acrylic acid ester as a primary component, in which the trialkyl phosphite transited from the substrate into the pressure-sensitive adhesive layer is not unevenly distributed on a surface of the pressure-sensitive adhesive layer; a method of processing a processed material using the same, and a piece of a processed material obtainable by the method.

Abstract: The present invention intends to provide a pressure-sensitive adhesive sheet for dicing which inhibits the generation of fibrous scraps and has good expandability.

Abstract: An adhesive sheet for dicing comprising a base film provided at least one surface thereof with an adhesive layer, wherein the base film comprises an olefinic thermoplastic elastomer comprising propylene and ethylene and/or ?-olefin including 4 to 8 carbon atoms as polymerization components, and the peak melting temperature of the olefinic thermoplastic elastomer is 120° C. or more, is free of economical disadvantages with less reduction in the quality level of products and less generation of fibrous off-cuts during dicing. In particular, fibrous off-cuts occur less during dicing when the base film contains a crystal-nucleating agent. Further, generation of chippings during dicing can be prevented by incorporation of an ethylene series polymer into the base film.

Abstract: Provided are a UV-curable pressure-sensitive adhesive composition comprising a photoinitiator which has a molar absorptivity at 365 nm of at least 1,000 mol?1·cm?1 and the maximum absorption wavelength of at least 420 nm on a long wavelength side; and an adhesive sheet having a layer of the composition disposed over a photo-transmitting base film. The pressure-sensitive adhesive sheet according to the invention can be cured even by exposure to ultraviolet rays at a low intensity or for short time so that it can contribute to energy saving and productivity improvement as a sheet for processing, fixation or surface protection of a semiconductor wafer.

Abstract: A method for providing direct control of the ink supply for printing presses based on an output of a multispectral measurement device includes: obtaining an output of the multispectral measurement from a plurality of printed items which are printed while varying the amount of ink dispensed, utilizing percentage dot area information in print editing from a printing plate for the printed item; determining a transfer function to calculate the amount of ink dispensed corresponding to the amount of change in the multispectral; and computing the amount of ink dispensed to be changed, by using the output deviation in the multispectral measurement output from the target colors for a commercially printed item, and the percentage dot area information related to the target colors of the commercially printed item to control the amount of ink dispensed by the foregoing ink dispensing apparatus.

Abstract: Provided are a UV-curable pressure-sensitive adhesive composition comprising a photoinitiator which has a molar absorptivity at 365 nm of at least 1,000 mol−1·cm−1 and the maximum absorption wavelength of at least 420 nm on a long wavelength side; and an adhesive sheet having a layer of the composition disposed over a photo-transmitting base film. The pressure-sensitive adhesive sheet according to the invention can be cured even by exposure to ultraviolet rays at a low intensity or for short time so that it can contribute to energy saving and productivity improvement as a sheet for processing, fixation or surface protection of a semiconductor wafer.

Abstract: Disclosed herein are an operation support unit, an operation support system, and an operation support method capable of supporting operation of a printer with reliability and stability. A suppression factor that is suppressed is set according to a control mode, and a plurality of control objects for the printer, effective in suppressing the suppression factor, is allocated as a control group. Then, a set of data that is under printing conditions nearly coinciding with the present predetermined printing conditions is collected from among a plurality of data sets in which printing conditions, printing-quality information, and mechanical information are correlated.

Abstract: The object of this invention is to provide a method for providing direct control of the ink supply for printing presses based on an output of the multispectral measurement means.

Abstract: Disclosed herein are an operation support unit, an operation support system, and an operation support method capable of supporting operation of a printer with reliability and stability. A suppression factor that is suppressed is set according to a control mode, and a plurality of control objects for the printer, effective in suppressing said suppression factor, is allocated as a control group. Then, a set of data that is under printing conditions nearly coinciding with the present predetermined printing conditions is collected from among a plurality of data sets in which printing conditions, printing-quality information, and mechanical information are correlated.

Abstract: An adhesive sheet for dicing comprising a base film provided at least one surface thereof with an adhesive layer, wherein the base film comprises an olefinic thermoplastic elastomer comprising propylene and ethylene and/or &agr;-olefin including 4 to 8 carbon atoms as polymerization components, and the peak melting temperature of the olefinic thermoplastic elastomer is 120° C. or more, is free of economical disadvantages with less reduction in the quality level of products and less generation of fibrous off-cuts during dicing. In particular, fibrous off-cuts occur less during dicing when the base film contains a crystal-nucleating agent. Further, generation of chippings during dicing can be prevented by incorporation of an ethylene series polymer into the base film.

Abstract: A pressure-sensitive adhesive sheet for dicing is disclosed which can prevent the generation of a fibrous waste during dicing without having a decrease in product quality or a disadvantage in cost. The pressure-sensitive adhesive sheet for dicing comprises a substrate film and formed thereon a pressure-sensitive adhesive layer for adhesively fixing a material to be diced, wherein the substrate film has a single- or multilayer structure wherein at least the layer thereof in contact with the pressure-sensitive adhesive layer comprises a semi- or non-compatibilized polymer blend comprising two or more polymers. At least one of the polymers constituting the polymer blend may be a highly crystalline olefin resin having a crystallinity of 40% or higher and the content of this polymer in the polymer blend may be from 1 to 50% by weight.

Abstract: Provided are a UV-curable pressure-sensitive adhesive composition comprising a photoinitiator which has a molar absorptivity at 365 nm of at least 1,000 mol−1·cm−1 and the maximum absorption wavelength of at least 420 nm on a long wavelength side; and an adhesive sheet having a layer of the composition disposed over a photo-transmitting base film. The pressure-sensitive adhesive sheet according to the invention can be cured even by exposure to ultraviolet rays at a low intensity or for short time so that it can contribute to energy saving and productivity improvement as a sheet for processing, fixation or surface protection of a semiconductor wafer.

Abstract: An ultraviolet curing pressure-sensitive adhesive sheet prepared by forming an ultraviolet curing pressure-sensitive adhesive layer on at least one surface of a substrate film and adhering a separator to the surface of the ultraviolet curing pressure-sensitive adhesive layer, wherein the separator has an ultraviolet transmittance at a wavelength of 300 to 400 nm of 65% or lower. The separator is obtained by forming a layer containing an ultraviolet absorber on the surface of the substrate film opposite the surface adhering to the pressure-sensitive adhesive layer or incorporating an ultraviolet absorber in the film. The ultraviolet curing pressure-sensitive adhesive sheet is useful as a semiconductor-protective pressure-sensitive adhesive sheet and a semiconductor wafer-fixing sheet, which can be used without causing a curing reaction with the exposure of a slight amount of ultraviolet rays from a surrounding environment at the standby for adhering wafers.