Patents by Inventor Shouji Yasunaga

Shouji Yasunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10770380
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: September 8, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20200161228
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: January 21, 2020
    Publication date: May 21, 2020
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10573584
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 25, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20190229042
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 25, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20190157193
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 10290565
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: May 14, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20170162486
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: February 23, 2017
    Publication date: June 8, 2017
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 9613927
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: April 4, 2017
    Assignee: Rohm Co., Ltd.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20150294952
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: June 25, 2015
    Publication date: October 15, 2015
    Inventors: Akihiro KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 9093434
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: July 28, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20140027891
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed
    Type: Application
    Filed: April 3, 2012
    Publication date: January 30, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
    Publication number: 20120168946
    Abstract: A semiconductor device includes a semiconductor chip, a lead arranged on a side portion of the semiconductor chip, and a wire, whose one end and another end are bonded to the semiconductor chip and the lead respectively, having a ball portion and a stitch portion wedged in side elevational view on the semiconductor chip and the lead respectively. An angle of approach of the wire to the lead is not less than 50°, and the length of the stitch portion is not less than 33 ?m.
    Type: Application
    Filed: September 11, 2010
    Publication date: July 5, 2012
    Applicant: ROHM CO., LTD
    Inventor: Shouji Yasunaga