Patents by Inventor Shoukai Zhang

Shoukai Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation system for communication device with box type chassis, box type chassis, and communication device
    Patent number: 9326419
    Abstract: A heat dissipation system in a box type chassis of a communication device includes an upper heat dissipation channel and a lower heat dissipation channel, which both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat dissipation channel and the lower heat dissipation channel are defined on sidewalls of the box type chassis, and the air intake vent of the upper heat dissipation channel is located above the air exhaust vent of the lower heat dissipation channel. An air baffle is arranged in the box type chassis to generate a circulative airflow in the box type chassis, and therefore, heat dissipated by a circuit board is circulated in the box type chassis through the airflow, the temperature in the box type chassis reaches an extent that prevents vapor from condensing or even becoming a water film.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: April 26, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Gang Chen, Shoukai Zhang, Liwen Shu, Weidong Tang
  • HEAT DISSIPATION SYSTEM FOR COMMUNICATION DEVICE WITH BOX TYPE CHASSIS, BOX TYPE CHASSIS, AND COMMUNICATION DEVICE
    Publication number: 20140098493
    Abstract: A heat dissipation system in a box type chassis of a communication device includes an upper heat dissipation channel and a lower heat dissipation channel, which both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat dissipation channel and the lower heat dissipation channel are defined on sidewalls of the box type chassis, and the air intake vent of the upper heat dissipation channel is located above the air exhaust vent of the lower heat dissipation channel. An air baffle is arranged in the box type chassis to generate a circulative airflow in the box type chassis, and therefore, heat dissipated by a circuit board is circulated in the box type chassis through the airflow, the temperature in the box type chassis reaches an extent that prevents vapor from condensing or even becoming a water film.
    Type: Application
    Filed: December 10, 2013
    Publication date: April 10, 2014
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Gang Chen, Shoukai Zhang, Liwen Shu, Weidong Tang