Abstract: Provided is a curable organopolysiloxane composition having favorable curing properties, maintaining a favorable pot life even as a single component composition and showing sharp and rapid curing reactivity triggered by ultraviolet light or other high energy beam irradiation and heating, and in which curing defect problems are less likely to occur even in light shielded portions where irradiation with a high energy beam such or the like is difficult. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having a monovalent hydrocarbon group containing an aliphatic unsaturated bond, (B) an organohydrogenpolysiloxane, (C) a first hydrosilylation catalyst that exhibits activity by irradiating with a high energy beam, and (D) a second hydrosilylation catalyst microencapsulated by a thermoplastic resin with a softening point within a temperature range of 50 to 200° C. In general, a hydrosilylation reaction inhibitor is substantially not required.

Abstract: A urethane resin composition obtained by a method comprising the steps of: melt mixing an isocyanate (B), an antioxidant (C), a release agent (D) and a dispersing agent (E) to obtain a molten mixture, and mixing the molten mixture and a polyol (A): wherein the release agent (D) is a compound represented by the following formula (1): [Chemical Formula 1] R1—COOH??(1) the dispersing agent (E) is a compound represented by the following formula (2) having a weight-average molecular weight Mw of no greater than 16000: and the content of the dispersing agent (E) in the urethane resin composition is 0.1 to 5.0 wt %.

Abstract: The curable resin composition of the present invention comprises a polyol component containing tri- or higher functional polycaprolactone polyol; and a polyisocyanate component containing bifunctional or trifunctional alicyclic isocyanate having one or more chemical structures in which an isocyanate group is bonded to a secondary carbon atom.

Abstract: The thermosetting resin composition of the present invention comprises a compound (A) containing an organic group having two or more carbon atoms and a hydrosilyl group, a compound (B) containing a carbon-carbon double bond, and a hydrosilylation catalyst (C), wherein the composition is liquid at 25° C.