Patents by Inventor Shoukuan WU
Shoukuan WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210240232Abstract: A rotating shaft mechanism includes: a rotating shaft bracket; a guide member, movably connected to the rotating shaft bracket; an elastic member, disposed between the guide member and the rotating shaft bracket; and two rotating arms. One of the two rotating arms is rotatably arranged on a first end of the rotating shaft bracket, and the other one is rotatably arranged on a second end of the rotating shaft bracket opposite to the first end. At least one of the two rotating arms abuts against the guide member. When the two rotating arms rotate relative to the rotating shaft bracket and move closer to each other, the guide member is driven to protrude out of the rotating shaft bracket.Type: ApplicationFiled: April 22, 2021Publication date: August 5, 2021Inventors: Jiao Cheng, Shoukuan Wu, Chuanhua Zeng
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Patent number: 10565426Abstract: The present disclosure provides a fingerprint chip package structure, an input assembly and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body.Type: GrantFiled: June 20, 2017Date of Patent: February 18, 2020Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan Wu, Zanjian Zeng
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Patent number: 10551947Abstract: A decoration enclosure, an input assembly and a terminal are provided. The decoration enclosure is configured for decorating a fingerprint identification structure of the input assembly, and includes a decoration ring and a support rim. The support rim extends inwards from an inner wall of the decoration ring and supports the fingerprint identification structure.Type: GrantFiled: June 20, 2017Date of Patent: February 4, 2020Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan Wu, Zanjian Zeng
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Patent number: 10361861Abstract: An input assembly and a terminal are provided. The input assembly includes a decoration enclosure and a fingerprint chip package structure. The decoration enclosure is configured for decorating the fingerprint chip package structure. The decoration enclosure includes a decoration ring for accommodating the fingerprint chip package structure and a support rim. The support rim extends inwards from an inner wall of the decoration ring.Type: GrantFiled: June 20, 2017Date of Patent: July 23, 2019Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan Wu, Zanjian Zeng
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Patent number: 10361862Abstract: An input assembly and a terminal are provided. The input assembly includes a decoration enclosure having a decoration ring and a support rim extending inwards from an inner wall of the decoration ring; and a fingerprint chip package structure received in the decoration ring and supported on the support rim. The decoration enclosure includes a flange extending outwards from an outer wall of the decoration ring, the flange and the decoration ring are separately formed, the decoration ring includes a muff-coupling portion connected to the support rim, and the flange is fitted over the muff-coupling portion. The fingerprint chip package structure includes: a package body having a bottom surface and a lateral surface connected to the bottom surface, and defining a recessed portion at a junction of the bottom surface and the lateral surface; and a fingerprint identification chip received in the package body.Type: GrantFiled: May 8, 2018Date of Patent: July 23, 2019Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan Wu, Zanjian Zeng
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Patent number: 10289892Abstract: The present disclosure provides a fingerprint chip package structure and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body. The package body packages the fingerprint identification chip therein. The package body includes a first package portion and a second package portion coupled to the first package portion. The first package portion includes the bottom surface, and the second package portion includes the lateral surface. The fingerprint chip package structure is configured to be received in a decoration enclosure.Type: GrantFiled: May 9, 2018Date of Patent: May 14, 2019Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan Wu, Zanjian Zeng
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Patent number: 10248251Abstract: A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a reinforcing plate, a first flexible circuit board, a fingerprint chip package structure and a fixed plate. The reinforcing plate has a first positioning structure and configured to reinforce the first flexible circuit board and the fingerprint chip package structure. The first flexible circuit board is fixed on the reinforcing plate. The fingerprint chip package structure is fixed on the first flexible circuit board. The fixed plate is fixed to the terminal and has a second positioning structure. The first positioning structure is configured to be fitted with the second positioning structure, so as to limit a movement of the reinforcing plate relative to the fixed plate.Type: GrantFiled: June 19, 2017Date of Patent: April 2, 2019Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP.Inventors: Shoukuan Wu, Zanjian Zeng
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Patent number: 10175790Abstract: A decoration enclosure and a terminal are provided. The decoration enclosure is configured for decorating a fingerprint identification structure of the input assembly, and includes a decoration ring and a support rim. The support rim extends inwards from an inner wall of the decoration ring and supports the fingerprint identification structure. The decoration enclosure includes a flange extending outwards from an outer wall of the decoration ring, the flange and the decoration ring are separately formed, the decoration ring includes a muff-coupling portion connected to the support rim, and the flange is fitted over the muff-coupling portion. The flange includes a first protrusion and a second protrusion coupled to the first protrusion. The first protrusion includes a first portion and a second portion. The second portion is coupled to the first portion and the second protrusion, and the second portion protrudes beyond the first portion and the second protrusion.Type: GrantFiled: May 9, 2018Date of Patent: January 8, 2019Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan Wu, Zanjian Zeng
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Patent number: 10168806Abstract: A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a decoration enclosure, a touch panel, a fingerprint chip package structure and a display screen component, and the touch panel defines a blind hole in a surface thereof. The method for manufacturing the input assembly includes: mounting the fingerprint chip package structure in the decoration enclosure; mounting the decoration enclosure carried with the fingerprint chip package structure in the blind hole; mounting the display screen component to the surface of the touch panel, in which a first orthographic projection of the display screen component in the surface of the touch panel overlaps a second orthographic projection of the decoration enclosure in the surface of the touch panel.Type: GrantFiled: June 12, 2017Date of Patent: January 1, 2019Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventor: Shoukuan Wu
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Publication number: 20180260046Abstract: A decoration enclosure and a terminal are provided. The decoration enclosure is configured for decorating a fingerprint identification structure of the input assembly, and includes a decoration ring and a support rim. The support rim extends inwards from an inner wall of the decoration ring and supports the fingerprint identification structure. The decoration enclosure includes a flange extending outwards from an outer wall of the decoration ring, the flange and the decoration ring are separately formed, the decoration ring includes a muff-coupling portion connected to the support rim, and the flange is fitted over the muff-coupling portion. The flange includes a first protrusion and a second protrusion coupled to the first protrusion. The first protrusion includes a first portion and a second portion. The second portion is coupled to the first portion and the second protrusion, and the second portion protrudes beyond the first portion and the second protrusion.Type: ApplicationFiled: May 9, 2018Publication date: September 13, 2018Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LT D.Inventors: Shoukuan WU, Zanjian ZENG
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Publication number: 20180260606Abstract: The present disclosure provides a fingerprint chip package structure and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body. The package body packages the fingerprint identification chip therein. The package body includes a first package portion and a second package portion coupled to the first package portion. The first package portion includes the bottom surface, and the second package portion includes the lateral surface. The fingerprint chip package structure is configured to be received in a decoration enclosure.Type: ApplicationFiled: May 9, 2018Publication date: September 13, 2018Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan WU, Zanjian ZENG
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Publication number: 20180262338Abstract: An input assembly and a terminal are provided. The input assembly includes a decoration enclosure having a decoration ring and a support rim extending inwards from an inner wall of the decoration ring; and a fingerprint chip package structure received in the decoration ring and supported on the support rim. The decoration enclosure includes a flange extending outwards from an outer wall of the decoration ring, the flange and the decoration ring are separately formed, the decoration ring includes a muff-coupling portion connected to the support rim, and the flange is fitted over the muff-coupling portion. The fingerprint chip package structure includes: a package body having a bottom surface and a lateral surface connected to the bottom surface, and defining a recessed portion at a junction of the bottom surface and the lateral surface; and a fingerprint identification chip received in the package body.Type: ApplicationFiled: May 8, 2018Publication date: September 13, 2018Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan WU, Zanjian ZENG
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Patent number: 10042449Abstract: A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a decoration enclosure, a touch panel, a fingerprint chip package structure and a display screen component, and the touch panel defines a blind hole in a lower surface thereof. The method for manufacturing the input assembly includes: mounting the fingerprint chip package structure in the decoration enclosure; mounting the decoration enclosure carried with the fingerprint chip package structure in the blind hole; mounting the display screen component to the lower surface of the touch panel, in which a first orthographic projection of the display screen component in the lower surface of the touch panel overlaps a second orthographic projection of the decoration enclosure in the lower surface of the touch panel.Type: GrantFiled: December 8, 2017Date of Patent: August 7, 2018Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventor: Shoukuan Wu
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Publication number: 20180101254Abstract: A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a decoration enclosure, a touch panel, a fingerprint chip package structure and a display screen component, and the touch panel defines a blind hole in a lower surface thereof. The method for manufacturing the input assembly includes: mounting the fingerprint chip package structure in the decoration enclosure; mounting the decoration enclosure carried with the fingerprint chip package structure in the blind hole; mounting the display screen component to the lower surface of the touch panel, in which a first orthographic projection of the display screen component in the lower surface of the touch panel overlaps a second orthographic projection of the decoration enclosure in the lower surface of the touch panel.Type: ApplicationFiled: December 8, 2017Publication date: April 12, 2018Inventor: Shoukuan Wu
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Publication number: 20180053035Abstract: The present disclosure provides a fingerprint chip package structure, an input assembly and a terminal. The fingerprint chip package structure includes a package body and a fingerprint identification chip. The package body includes a bottom surface and a lateral surface connected to the bottom surface, and defines a recessed portion at a junction of the bottom surface and the lateral surface. The fingerprint identification chip is received in the package body.Type: ApplicationFiled: June 20, 2017Publication date: February 22, 2018Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan WU, Zanjian ZENG
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Publication number: 20180052538Abstract: A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a decoration enclosure, a touch panel, a fingerprint chip package structure and a display screen component, and the touch panel defines a blind hole in a surface thereof. The method for manufacturing the input assembly includes: mounting the fingerprint chip package structure in the decoration enclosure; mounting the decoration enclosure carried with the fingerprint chip package structure in the blind hole; mounting the display screen component to the surface of the touch panel, in which a first orthographic projection of the display screen component in the surface of the touch panel overlaps a second orthographic projection of the decoration enclosure in the surface of the touch panel.Type: ApplicationFiled: June 12, 2017Publication date: February 22, 2018Inventor: Shoukuan WU
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Publication number: 20180054313Abstract: An input assembly and a terminal are provided. The input assembly includes a decoration enclosure and a fingerprint chip package structure. The decoration enclosure is configured for decorating the fingerprint chip package structure. The decoration enclosure includes a decoration ring for accommodating the fingerprint chip package structure and a support rim. The support rim extends inwards from an inner wall of the decoration ring.Type: ApplicationFiled: June 20, 2017Publication date: February 22, 2018Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan WU, Zanjian ZENG
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Publication number: 20180052561Abstract: A method for manufacturing an input assembly, an input assembly and a terminal are provided. The input assembly includes a reinforcing plate, a first flexible circuit board, a fingerprint chip package structure and a fixed plate. The reinforcing plate has a first positioning structure and configured to reinforce the first flexible circuit board and the fingerprint chip package structure. The first flexible circuit board is fixed on the reinforcing plate. The fingerprint chip package structure is fixed on the first flexible circuit board. The fixed plate is fixed to the terminal and has a second positioning structure. The first positioning structure is configured to be fitted with the second positioning structure, so as to limit a movement of the reinforcing plate relative to the fixed plate.Type: ApplicationFiled: June 19, 2017Publication date: February 22, 2018Inventors: Shoukuan WU, Zanjian ZENG
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Publication number: 20180052539Abstract: A decoration enclosure, an input assembly and a terminal are provided. The decoration enclosure is configured for decorating a fingerprint identification structure of the input assembly, and includes a decoration ring and a support rim. The support rim extends inwards from an inner wall of the decoration ring and supports the fingerprint identification structure.Type: ApplicationFiled: June 20, 2017Publication date: February 22, 2018Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Shoukuan WU, Zanjian ZENG