Patents by Inventor Shouma ANABUKI

Shouma ANABUKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230345631
    Abstract: Provided is a prepreg for producing a multilayer printed wiring board having high reliability and being excellent in adhesiveness with respect to a base material or the like. The prepreg includes: a base material; and a polymer having a structural unit represented by at least one kind of the following formulae (1-1), (1-2), and (1-3).
    Type: Application
    Filed: August 19, 2021
    Publication date: October 26, 2023
    Applicant: JSR CORPORATION
    Inventors: Nobuyuki MIYAKI, Naoyuki KAWASHIMA, Yuutoku YAMASHITA, Shouma ANABUKI, Kenta NISHINO, Takeru KAMEYAMA
  • Publication number: 20200354512
    Abstract: A polymer, includes a first structural unit represented by formula (1), a second structural unit represented by formula (2-1), formula (2-2), or both, and a third structural unit represented by formula (3-1), formula (3-2), or both. The polymer preferably has a weight-average molecular weight in terms of polystyrene of 500 or more and 400,000 or less. A composition includes the polymer and an organic solvent. A molded body includes the polymer.
    Type: Application
    Filed: July 29, 2020
    Publication date: November 12, 2020
    Applicant: JSR CORPORATION
    Inventors: SHOUMA ANABUKI, Ryouyuu HIFUMI, Toshiaki KADOTA, Ryouji TATARA, Nobuyuki MIYAKI
  • Publication number: 20190169362
    Abstract: A polymer, includes a first structural unit represented by formula (1), a second structural unit represented by formula (2-1), formula (2-2), or both, and a third structural unit represented by formula (3-1), formula (3-2), or both. The polymer preferably has a weight-average molecular weight in terms of polystyrene of 500 or more and 400,000 or less. A composition includes the polymer and an organic solvent. A molded body includes the polymer.
    Type: Application
    Filed: January 28, 2019
    Publication date: June 6, 2019
    Applicant: JSR CORPORATION
    Inventors: Shouma ANABUKI, Ryouyuu HIFUMI, Toshiaki KADOTA, Ryouji TATARA, Nobuyuki MIYAKI