Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.

Abstract: A data management method for a network. Whether a first record in a database is updated is automatically determined. Content of the first record is organized in a hierarchical structure. Which of a group of clients is affected by update of the first record is automatically determined. A data format corresponding to an affected client is automatically determined. A message is automatically generated by modifying the hierarchical structure according to the data format. The message comprising the result of modifying the hierarchical structure is automatically transmitted to the affected client.

Abstract: A data management method for a network. Whether a first record in a database is updated is automatically determined. Content of the first record is organized in a hierarchical structure. Which of a group of clients is affected by update of the first record is automatically determined. A data format corresponding to an affected client is automatically determined. A message is automatically generated by modifying the hierarchical structure according to the data format. The message comprising the result of modifying the hierarchical structure is automatically transmitted to the affected client.