Patents by Inventor Shouzhong (Alex) Du

Shouzhong (Alex) Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9283698
    Abstract: A method for manufacturing a component including a bi-metallic sheet includes performing a manufacturing process that heats the bi-metallic sheet and physically constraining the bi-metallic sheet from deformation during the cooling of the bi-metallic sheet. Optionally, the method additionally includes physically constraining the bi-metallic sheet from deformation during the manufacturing process that heats the bi-metallic sheet. A constraining apparatus is also disclosed and includes a first constraining component having a first thermally conductive contact surface adapted to abut a first surface of a metal sheet, a second constraining component having a second contact surface adapted to abut a second surface of the metal sheet, and an engaging device operative to fix the first constraining component and the second constraining component in position relative to one another. The metal sheet is constrained between the first contact surface and the second contact surface during heating and/or cooling.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: March 15, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Dongji Xie, Jichen (Jeff) Qin
  • Patent number: 8681485
    Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 25, 2014
    Assignee: Flextronics AP, LLC
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin, Wu Bing (Levin) Li, Suriaprakash Narotamo
  • Publication number: 20110239725
    Abstract: A method for manufacturing a component including a bi-metallic sheet includes performing a manufacturing process that heats the bi-metallic sheet and physically constraining the bi-metallic sheet from deformation during the cooling of the bi-metallic sheet. Optionally, the method additionally includes physically constraining the bi-metallic sheet from deformation during the manufacturing process that heats the bi-metallic sheet. A constraining apparatus is also disclosed and includes a first constraining component having a first thermally conductive contact surface adapted to abut a first surface of a metal sheet, a second constraining component having a second contact surface adapted to abut a second surface of the metal sheet, and an engaging device operative to fix the first constraining component and the second constraining component in position relative to one another. The metal sheet is constrained between the first contact surface and the second contact surface during heating and/or cooling.
    Type: Application
    Filed: March 31, 2011
    Publication date: October 6, 2011
    Inventors: Shouzhong (Alex) DU, Richard Dale Michonski, Dongji Xie, Jichen (Jeff) Qin
  • Publication number: 20110186455
    Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.
    Type: Application
    Filed: December 22, 2010
    Publication date: August 4, 2011
    Inventors: Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin, Wu Bing (Levin) Li, Suriaprakash Narotamo