Patents by Inventor Shouzi Sakemi

Shouzi Sakemi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5692669
    Abstract: A printed circuit board comprising a plurality of lands onto which a plurality of leads of an electronic component are soldered. These lands are arrayed in parallel one another. Each of these lands includes a narrow portion basically extending in a longitudinal direction thereof and having a predetermined constant width, and a wide portion protruding laterally from both edges of the narrow portion.
    Type: Grant
    Filed: April 12, 1995
    Date of Patent: December 2, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shouzi Sakemi, Tadahiko Sakai
  • Patent number: 5428505
    Abstract: A printed circuit board comprising a plurality of lands onto which a plurality of leads of an electronic component are soldered. These lands are arrayed in parallel one another. Each of these lands includes a narrow portion basically extending in a longitudinal direction thereof and having a predetermined constant width, and a wide portion protruding laterally from both edges of the narrow portion.
    Type: Grant
    Filed: August 5, 1994
    Date of Patent: June 27, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shouzi Sakemi, Tadahiko Sakai