Patents by Inventor Shouzou Katsuki

Shouzou Katsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded wafer, process for producing same and substrate
    Patent number: 6198159
    Abstract: A bonded wafer in which silicon wafers and an amorphous heat fusion bonding polyimide are used, a process for producing the same, and a substrate which is prepared by variously processing the bonded wafer.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: March 6, 2001
    Assignee: Ube Industries, Ltd.
    Inventors: Toshinori Hosoma, Kazuhiko Yosioka, Shouzou Katsuki