Abstract: A pattern data inspection method includes the steps of (a) carrying out a logical/sizing process with respect to original pattern data, (b) carrying out a reverse-logical/reverse-sizing process with respect to pattern data subjected to the logical/sizing process, and (c) carrying out a logical process with respect to the original pattern data and pattern data subjected to the reverse-logical/reverse-sizing process, and inspecting the pattern data subjected to the logical/sizing process.

Abstract: A pattern inspection method includes the steps of: obtaining first image data by optically picking up an actually formed pattern such as a reticle; aligning a position of the first image data with second image data of a pattern at a different layer from that of the first image data; and performing a first pattern inspection using the first and second image data. Defect inspection can be executed in a short time with a practically sufficient precision.

Abstract: A method and an apparatus for inspecting a high density pattern in which a signal obtained by scanning a mask substrate having a high density pattern including repeated pattern portions is collated and compared with the signal obtained from original data used to generate the pattern. Repeated pattern data corresponding to the signal obtained by scanning said mask substrate and the repeated basic pattern data corresponding to the basic pattern of the repeated pattern portion are repeatedly collated and compared when inspecting repeated pattern portions and the repeated pattern data and the original pattern data obtained by sequentially converting the original data in synchronization with the scanning are collated and compared when inspecting the high density pattern of an area other than the repeated pattern portions.