Patents by Inventor Shoya YAMAMOTO

Shoya YAMAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit module having a plurality of lead frames connected to a substrate by metal posts
    Patent number: 11935819
    Abstract: In a circuit module, lead frames include top surfaces facing a main surface of a substrate and bottom surfaces exposed from an insulating seal. The lead frames include pad portions including portions of the top surfaces and connected to metal posts, and lead portions including the bottom surfaces. The pad portions completely overlap the metal posts.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 19, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideshi Okada, Shoya Yamamoto
  • CIRCUIT MODULE
    Publication number: 20220293497
    Abstract: In a circuit module, lead frames include top surfaces facing a main surface of a substrate and bottom surfaces exposed from an insulating seal. The lead frames include pad portions including portions of the top surfaces and connected to metal posts, and lead portions including the bottom surfaces. The pad portions completely overlap the metal posts.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 15, 2022
    Inventors: Hideshi OKADA, Shoya YAMAMOTO