Patents by Inventor Shozaburo Iwai

Shozaburo Iwai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for hermetic sealing of electronic parts
    Patent number: 6691911
    Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: February 17, 2004
    Assignee: Tanaka Kikinzoku Kogky K.K.
    Inventors: Shozaburo Iwai, Masaru Kobayashi, Osamu Sawada
  • Method for hermetic sealing of electronic parts
    Publication number: 20020190106
    Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.
    Type: Application
    Filed: June 13, 2002
    Publication date: December 19, 2002
    Inventors: Shozaburo Iwai, Masaru Kobayashi, Osamu Sawada