Abstract: An embossed carrier tape, having a concave region (21a) for placing an electronic part on one surface (20a) and a convex region (21b) complementary to the concave region (21a) on a second surface (20b) is disclosed. The width (L2) at the top of the convex region (21b) is longer than the width (L1) of the opening of the concave region (21a), while the width (L1) of the opening of the concave region (21a) is longer than the width (L3) at the bottom. With this arrangement, when the embossed carrier tape 20 is vertically overlapped with the convex regions (21b) being oriented downward, the convex region (21b) of the upper embossed carrier tape (20) is unable to enter the concave region (21a) of the under embossed carrier tape.

Abstract: An optical semiconductor device, having an optical element mounted in a case and an optical fiber fixed to the case with a first photosetting resin, includes a transparent plate placed on a surface layer portion of the first photosetting resin to transmit light that cures the first photosetting resin. The transparent plate is integrated with the cured photosetting resin, and the optical element is a light emitting element.

Abstract: A fabrication method of a plastic-packaged semiconductor device is provided, which prevents the high-frequency characteristics of a semiconductor element chip from degrading without complicating a package configuration. In the first step, a wax with a property of being solid at room temperature (e.g. paraffin wax) is melted due to heat and coated to cover bonding terminals of a semiconductor element chip, thereby forming a wax layer at a location where a cavity is formed. In the second step, the wax layer and the chip are covered with a liquid-like thermosetting packaging resin produced by dissolution in a solvent. In the third step, the packaging resin covering the wax layer and the chip is cured to form a plastic package and at the same time, the wax layer is melted to penetrate into the package due to application of heat at a first temperature, thereby forming the cavity inside the package at the location where the wax layer has been formed.