Patents by Inventor Shozi Ikeda

Shozi Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board
    Patent number: 5851681
    Abstract: This invention relates to a wiring structure having metal wiring layers and polyimide layers. An object of this invention is to overcome problems caused by oxidation of a metal surface, such as an increase in the resistance of wiring and a reduction in insulation, by preventing a reaction between a metal of the wiring layers, such as copper, and carboxyl groups of polyamic acid which make up the polyimide layers. In the wiring structure according to the present invention, the polyimide layers have been formed by heating and curing a resin composition which comprises a polyimide precursor, an amine compound and an organic solvent.
    Type: Grant
    Filed: March 15, 1994
    Date of Patent: December 22, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Haruhiko Matsuyama, Eiji Matsuzaki, Shozi Ikeda, Fumio Kataoka, Fusaji Shoji