Abstract: The invention provides a circularity and cylindrical shape measuring device that can decrease the measurement errors generated due to the weight of a measured workpiece.

Abstract: The invention provides a circularity and cylindrical shape measuring device that can decrease the measurement errors generated due to the weight of a measured workpiece. A circularity and cylindrical shape measuring device (10) is configured such that a rotation axis of a rotary table (30) is positioned on a leg (21) that supports a base table (20) or is positioned on a straight line that connects adjacent legs (21A and 21B).

Abstract: A work holder (22) for holding work (W) has a porous body (34) disposed in the inner periphery thereof, and work (W) is held in the center of the work holder (22) by the centripetal action of the air spouted from the porous body (34). The work (W) held in the work holder (22) has its end surface imaged by a CCD camera (54), and according to the image of the end surface of the work project on the CCD, the eccentricity of the work (W) can be taken without rotating the work (W). Thus, a size measuring method and a device therfor can be provided which are capable of taking a simple and accurate size measurement of work by means of a simple arrangement.

Abstract: A cylindrically formed master work is inserted into a work socket hole, and the master work is held at the center of the work socket hole by injecting compressed air from the inner circumferential face of the work socket hole toward the center of the work socket hole. In this state, the master work is rotated, and the end face of the master work is imaged three times with a CCD camera at different rotational angles. By computing the positions of bore centers from the three sets of obtained image data and the center of a circle passing those bore centers, the external shape center of the master work projected on the CCD is determined. Thus, the position of the external shape center of the work is easily and accurately determined.

Abstract: A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane.

Abstract: An opening for loading and unloading ingots is formed at the top of a cover, which covers a processing chamber wherein grooved rollers of a wire saw are disposed. The ingots are exchanged from above the cover through the opening. Even if a plurality of wire saws are arranged at short intervals, the adjacent wire saws can exchange the ingots at the same time, Thus, the ingots can be exchanged efficiently.

Abstract: The moving direction of the wire line 15A at the cut portion 44 for cutting the columnar semiconductor ingot 18 corresponds to the vertical-downward direction. And, the semiconductor ingot 18 supported with the cut-feed means 20 is fed horizontally so as to be pushed in perpendicular to said wire line 15A, and the processing liquid 42 is supplied to the wire line 15A from the grind liquid supply nozzle 40 placed at the upper side of the cut portion 44. Therefore, the processing liquid 42 supplied to the wire line 15A flows along the wire line 15A, so that the processing liquid 42 can be surely supplied to the cut portion 44.

Abstract: A microswitch is provided near each end of each grooved roller. The microswitch has a rod-shaped contact shoe, and is operated if a wire derailed from the grooved roller contacts the contact shoe. An operational signal is sent from the microswitch to a control apparatus, and the control apparatus receives the operational signal so as to detect that the wire is derailed.

Abstract: A turn table is connected to a rotary shaft of a driving motor for driving a wire reel coaxially therewith. The wire reel is connected onto this turn table. With this arrangement, the wire reel is directly driven by the driving motor. Accordingly, the period of time needed for acceleration or deceleration for the driving motor can be shortened, so that through-put can be improved. Furthermore, for the driving motor, a motor being low in inertia, i.e., a small-sized motor can be used, so that a driving section can be made compact in size. Further, a space for a belt transmission mechanism, which has heretofore been necessary, can be saved, so that the driving section can be made compact in size.

Abstract: A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by means of a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane.

Abstract: A microswitch is provided near each end of each grooved roller. The microswitch has a rod-shaped contact shoe, and is operated if a wire derailed from the grooved roller contacts the contact shoe. An operational signal is sent from the microswitch to a control apparatus, and the control apparatus receives the operational signal so as to detect that the wire is derailed.

Abstract: A wire is put on a guide roller, which guides the wire in a direction of a wire reel's axis. A wire load, which changes according to the displacement of the supply angle of the wire on the guide roller, is detected sequentially. Then, the guiding speed of the guide roller is sequentially controlled to adjust the wire displacement. Therefore, when the displacement of the wire supply angle changes, the guiding speed of the wire can quickly respond to the change.

Abstract: With a laser processing apparatus, the membrane of a membrane-covered film is accurately processed with a scanning laser beam linearly both in the direction of conveyance of the film and in a widthwise direction forming an angle with the direction of conveyance simultaneously, and particles splashed or scattered from the membrane by application of the laser beam are positively removed for protection of the film and the laser beam applying heads. A method of applying a scanning laser beam to a workpiece to be processed where the scanning beam is so formed that the portion of the workpiece which is processed with it shows a smooth boundary in the direction of processing.