Patents by Inventor Shozo Katsuki

Shozo Katsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7232610
    Abstract: A metal-coated aromatic polyimide film having high peel strength between the polyimide film and the metal coat can be advantageously prepared by the steps of treating an aromatic polyimide film composed of a polyimide substrate layer of aromatic polyimide having biphenyltetracarboxylic acid units in its molecular structure coated with a polyimide surface layer of aromatic polyimide having bendable bondings in its molecular structure, with electric discharge under reduced pressure, to produce protrusions connected with each other in the form of network of chain on the surface layer, and placing plural metal films on the surface layer having the protrusions.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: June 19, 2007
    Assignee: UBE Industries, Ltd.
    Inventors: Shozo Katsuki, Hidenori Mii
  • Patent number: 7193707
    Abstract: The present invention provides a small sized wide wave-range spectroscope with a simple structure which requires a short time to measure light for measurement over a wide wavelength spectrum. The small sized wide wave-range spectroscope has a collimator (43) for changing light for measurement (L) transmitted through a slit (41) into collimated light (L0), a plurality of diffraction gratings (44a, 44b) with different grating constants d supported rotatably around a rotational axis in parallel with the incident slit (41) and disposed side by side in the direction of the rotational axis in the optical path of the collimated light (L0), and a diffracted-light focusing members (45a, 45b) for focusing a plurality of diffracted light rays (L1 to L4) provided by the plurality of diffraction gratings (44a, 44b) by which the collimated light (L0) is diffracted, each of the diffracted-light focusing members (45a, 45b) being provided in association with each of the plurality of diffraction gratings (44a, 44b).
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: March 20, 2007
    Assignee: Ube Industries, Ltd.
    Inventors: Akira Ohnishi, Sumitaka Tachikawa, Shozo Katsuki, Koji Masutani
  • Patent number: 7174268
    Abstract: A wireless measuring device 1 is provided which includes a plurality of child units 2 and a parent unit 3 to receive data measured by these child units 2 by wireless communication. Each of the child units 2 has a controlling section 20 that can move to a standby state, a measuring section 21, a signal receiving section 22 to receive a measurement instructing signal from the parent unit 3, and a signal transmitting section 23 to transmit the measured data by wireless communication. The parent unit 3 has a signal transmitting section to transmit the measurement instructing signal to each of the child units 2 and a measured data receiving section 32 to receive measured data to be transmitted from the signal transmitting section 23.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: February 6, 2007
    Assignees: Ube Industries Ltd., Takion Co., Ltd.
    Inventors: Shozo Katsuki, Yutaka Saitoh, Tsutomu Tanaka, Akira Ohnishi, Sumitaka Tachikawa
  • Publication number: 20060067376
    Abstract: The emissivity measuring device 10 of the present invention includes an integrating sphere 18 having an energy entering hole 12 through which radiation energy is made to enter from an infrared ray source 11, a sample hole 14 placed being opposite to an entering direction of radiation energy supplied from the energy entering hole 12 and open edge portions of which are put into contact, in a struck manner, with an object 13 to be tested, and a detecting hole 16 to which a detector 15 to detect radiation energy is attached, wherein the detector 15 detects radiation energy emitted from the object 13 to be tested being multiple-scattered by the integrating sphere 17 via the detecting hole 16 and the detected radiation energy is compared with a measured value of emissivity of a known sample in a calculation controlling means 18 to calculate emissivity of the object 13 to be tested. The temperature sensor is attached to aperture edge portions of the sample hole 14.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 30, 2006
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Shozo Katsuki, Akira Ohnishi, Sumitaka Tachikawa, Hosei Nagano, Hiroaki Yamana
  • Publication number: 20060052987
    Abstract: A wireless measuring device 1 is provided which includes a plurality of child units 2 and a parent unit 3 to receive data measured by these child units 2 by wireless communication. Each of the child units 2 has a controlling section 20 that can move to a standby state, a measuring section 21, a signal receiving section 22 to receive a measurement instructing signal from the parent unit 3, and a signal transmitting section 23 to transmit the measured data by wireless communication. The parent unit 3 has a signal transmitting section to transmit the measurement instructing signal to each of the child units 2 and a measured data receiving section 32 to receive measured data to be transmitted from the signal transmitting section 23.
    Type: Application
    Filed: August 18, 2005
    Publication date: March 9, 2006
    Applicants: UBE INDUSTRIES, LTD., TAKION CO., LTD.
    Inventors: Shozo Katsuki, Yutaka Saitoh, Tsutomu Tanaka, Akira Ohnishi, Sumitaka Tachikawa
  • Patent number: 6979497
    Abstract: An electro-conductive metal plated polyimide substrate is composed of an aromatic polyimide substrate, a subbing metal layer of Mo—Ni alloy (in which a weight ratio of Mo to Ni is 75/25 to 99/1, and a plated electro-conductive film.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: December 27, 2005
    Assignee: UBE Industries, Ltd.
    Inventors: Shozo Katsuki, Hidenori Mii
  • Publication number: 20050168738
    Abstract: The present invention provides a small sized wide wave-range spectroscope with a simple structure which requires a short time to measure light for measurement over a wide wavelength spectrum. The small sized wide wave-range spectroscope has a collimator (43) for changing light for measurement (L) transmitted through a slit (41) into collimated light (L0), a plurality of diffraction gratings (44a, 44b) with different grating constants d supported rotatably around a rotational axis in parallel with the incident slit (41) and disposed side by side in the direction of the rotational axis in the optical path of the collimated light (L0), and a diffracted-light focusing members (45a, 45b) for focusing a plurality of diffracted light rays (L1 to L4) provided by the plurality of diffraction gratings (44a, 44b) by which the collimated light (L0) is diffracted, each of the diffracted-light focusing members (45a, 45b) being provided in association with each of the plurality of diffraction gratings (44a, 44b).
    Type: Application
    Filed: February 1, 2005
    Publication date: August 4, 2005
    Inventors: Akira Ohnishi, Sumitaka Tachikawa, Shozo Katsuki, Koji Masutani
  • Publication number: 20050118438
    Abstract: A metal-coated aromatic polyimide film having high peel strength between the polyimide film and the metal coat can be advantageously prepared by the steps of treating an aromatic polyimide film composed of a polyimide substrate layer of aromatic polyimide having biphenyltetracarboxylic acid units in its molecular structure coated with a polyimide surface layer of aromatic polyimide having bendable bondings in its molecular structure, with electric discharge under reduced pressure, to produce protrusions connected with each other in the form of network of chain on the surface layer, and placing plural metal films on the surface layer having the protrusions.
    Type: Application
    Filed: January 10, 2005
    Publication date: June 2, 2005
    Inventors: Shozo Katsuki, Hidenori Mii
  • Publication number: 20050019598
    Abstract: A copper-clad laminate is composed of a polyimide film and an electrolytically plated copper film placed on at least one surface side of the polyimide film, in which the copper film has at most 200 protrusions having a diameter of 15 ?m or more on its surface not facing the polyimide film, and the laminate has a peel strength of 1 kgf/cm or more and shows a peel strength of 0.6 kgf/cm or more after heating at 150° C. for 24 hours.
    Type: Application
    Filed: October 29, 2003
    Publication date: January 27, 2005
    Applicant: Ube Industries, Ltd.
    Inventors: Shozo Katsuki, Hiroto Shimokawa
  • Patent number: 6838184
    Abstract: An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 ?m, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2·24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: January 4, 2005
    Assignee: Ube Industries, Ltd.
    Inventors: Takuji Takahashi, Toshihiko Anno, Kohji Narui, Shozo Katsuki
  • Patent number: 6824827
    Abstract: A method of surface treating a polyimide film to impart improved adhesion to metal which comprises treating the surface of a polyimide film having a biphenyltetracarboxylic acid component by contact to a solution containing potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and treating said surface with an acid.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: November 30, 2004
    Assignee: Ube Industries, Ltd.
    Inventors: Shozo Katsuki, Toshihiko Anno, Osamu Nakayama, Hiroaki Yamaguchi
  • Publication number: 20040110024
    Abstract: An electro-conductive metal plated polyimide substrate is composed of an aromatic polyimide substrate, a subbing metal layer of Mo—Ni alloy (in which a weight ratio of Mo to Ni is 75/25 to 99/1, and a plated electro-conductive film.
    Type: Application
    Filed: November 19, 2003
    Publication date: June 10, 2004
    Applicant: Ube Industries, Ltd.
    Inventors: Shozo Katsuki, Hidenori Mii
  • Publication number: 20040076765
    Abstract: A method of surface treating a polyimide film to impart improved adhesion to metal which comprises treating the surface of a polyimide film having a biphenyltetracarboxylic acid component by contact to a solution containing potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and treating said surface with an acid.
    Type: Application
    Filed: October 9, 2003
    Publication date: April 22, 2004
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Shozo Katsuki, Toshihiko Anno, Osamu Nakayama, Hiroaki Yamaguchi
  • Publication number: 20030180557
    Abstract: An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 &mgr;m, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2·24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.
    Type: Application
    Filed: March 21, 2003
    Publication date: September 25, 2003
    Applicant: Ube Industries, Ltd.
    Inventors: Takuji Takahashi, Toshihiko Anno, Kohji Narui, Shozo Katsuki
  • Publication number: 20030049487
    Abstract: A metal-coated aromatic polyimide film having high peel strength between the polyimide film and the metal coat can be advantageously prepared by the steps of treating an aromatic polyimide film composed of a polyimide substrate layer of aromatic polyimide having biphenyltetracarboxylic acid units in its molecular structure coated with a polyimide surface layer of aromatic polyimide having bendable bondings in its molecular structure, with electric discharge under reduced pressure, to produce protrusions connected with each other in the form of network of chain on the surface layer, and placing plural metal films on the surface layer having the protrusions.
    Type: Application
    Filed: July 11, 2002
    Publication date: March 13, 2003
    Inventors: Shozo Katsuki, Hidenori Mii
  • Publication number: 20030012927
    Abstract: A metal-coated aromatic polyimide film having high peel strength between the polyimide film and the metal coat can be advantageously prepared by the steps of treating an aromatic polyimide film composed of a polyimide substrate layer of aromatic polyimide having biphenyltetracarboxylic acid units in its molecular structure coated with a polyimide surface layer of aromatic polyimide having bendable bondings in its molecular structure, with electric discharge under reduced pressure, to produce protrusions connected with each other in the form of network of chain on the surface layer, and placing plural metal films on the surface layer having the protrusions.
    Type: Application
    Filed: March 7, 2002
    Publication date: January 16, 2003
    Applicant: Ube Industries, Ltd.
    Inventors: Shozo Katsuki, Hidenori Mii
  • Publication number: 20020177000
    Abstract: A method of surface treating a polyimide film to impart improved adhesion to metal which comprises treating the surface of a polyimide film having a biphenyltetracarboxylic acid component by contact to a solution containing potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and treating said surface with an acid.
    Type: Application
    Filed: March 29, 2002
    Publication date: November 28, 2002
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Shozo Katsuki, Toshihiko Anno, Osamu Nakayama, Hiroaki Yamaguchi