Abstract: Provided are a pressure-sensitive adhesive tape, which has a needed pressure-sensitive adhesive force for an adherend, can remove even foreign matter at a submicron level without contaminating a cleaning site, is excellent in heat resistance, exerts a sufficient pressure-sensitive adhesive force and a sufficient cohesive force even at a high temperature, and can be easily peeled without generating any adhesive residue on the adherend upon peeling from the adherend after its use, and a method of producing the tape. The pressure-sensitive adhesive tape of the present invention includes, on a surface of a support, an assembly layer of oblique columnar structures each protruding at an elevation angle of less than 90° from the surface of the support, the oblique columnar structures each having an aspect ratio of 1 or more.

Abstract: A joint forming sheet comprising a substrate having an easy release surface having a contact angle with water of at least 50.degree., having provided on the easy release surface thereof an inorganic thin layer, the interfacial adhesive force of the inorganic thin layer to the substrate surface being greater than the tensile strength of the inorganic thin layer. The inorganic thin layer can be released and transferred to a part on which an electrical joint is to be formed with high precision to form a joint causing no electrical connection failure.

Abstract: A transparent electrically conductive film and processes for the production thereof are described, said film comprising a metallic oxide wherein the metallic component comprises from 60 to 95 wt % indium and from 40 to 5 wt % tin formed on the surface of a plastic base, wherein the weight ratio of the tin to the indium changes continuously from the outer surface to the inner surface in such a manner that the ratio on the inner surface of the film is appreciably lower than the average ratio of the film and the ratio on the outer surface of the film is appreciably higher than the average ratio of the film.