Patents by Inventor Shozo Takada

Shozo Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11655152
    Abstract: A carbon foam comprising linear portions and node portions joining the linear portions, wherein the linear portions have a diameter of 0.1 ?m or more and 10.0 ?m or less, and the carbon foam has a surface with an area of 100 cm2 or more.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: May 23, 2023
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Atsushi Suzuki, Junya Yamashita, Shozo Takada
  • Patent number: 11171339
    Abstract: Provided is a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions; and a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions, where the carbon content is 51 mass % or more, and the mean deviation of coefficient of friction by the Kawabata evaluation system method is 0.006 or less.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: November 9, 2021
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Junya Yamashita, Satomi Fukunaga, Atsushi Suzuki, Shozo Takada
  • Publication number: 20200161670
    Abstract: Provided is a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions; and a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions, where the carbon content is 51 mass % or more, and the mean deviation of coefficient of friction by the Kawabata evaluation system method is 0.006 or less.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 21, 2020
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Junya YAMASHITA, Satomi FUKUNAGA, Atsushi SUZUKI, Shozo TAKADA
  • Publication number: 20200010322
    Abstract: A carbon foam comprising linear portions and node portions joining the linear portions, wherein the linear portions have a diameter of 0.1 ?m or more and 10.0 ?m or less, and the carbon foam has a surface with an area of 100 cm2 or more.
    Type: Application
    Filed: March 12, 2018
    Publication date: January 9, 2020
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Atsushi SUZUKI, Junya YAMASHITA, Shozo TAKADA
  • Patent number: 10301517
    Abstract: A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: (I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: May 28, 2019
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Akinori Inoue, Shozo Takada
  • Publication number: 20170283672
    Abstract: A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: (I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Applicant: ASAHI KASEl KABUSHIKI KAISHA
    Inventors: Akinori Inoue, Shozo Takada
  • Patent number: 9577164
    Abstract: A semiconductor light emitting device, which can endure a dicing step for singulation, is superior in resistance to a high/low thermal cycle, and exhibits a high light extraction efficiency, and an optical film, which can be used favorably for producing the semiconductor light emitting device, are to be provided.
    Type: Grant
    Filed: September 1, 2014
    Date of Patent: February 21, 2017
    Assignee: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Hiroyuki Tsujimoto, Atsushi Suzuki, Junji Kato, Shozo Takada
  • Publication number: 20160211425
    Abstract: A semiconductor light emitting device, which can endure a dicing step for singulation, is superior in resistance to a high/low thermal cycle, and exhibits a high light extraction efficiency, and an optical film, which can be used favorably for producing the semiconductor light emitting device, are to be provided.
    Type: Application
    Filed: September 1, 2014
    Publication date: July 21, 2016
    Applicant: Asahi Kasei E-materials Corporation
    Inventors: Hiroyuki TSUJIMOTO, Atsushi SUZUKI, Junji KATO, Shozo TAKADA
  • Publication number: 20130269992
    Abstract: An insulating structure is formed that favorably maintains gap-fill capability of a narrow width pattern in a memory cell while also preventing the formation of cracks in an insulator in a peripheral circuit, and has the memory cell and peripheral circuit within the same layer. The present invention provides an insulating structure comprising a substrate and a circuit pattern formed on the substrate, wherein the circuit pattern has a narrow width region having a narrow width pattern of a width of 30 nm or less and a wide width region having a wide width pattern of a width of greater than 100 nm in the same layer, and the same insulating composition is formed within the narrow width pattern and within the wide width pattern.
    Type: Application
    Filed: December 22, 2011
    Publication date: October 17, 2013
    Applicant: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Ichiro Doi, Shozo Takada, Reiko Mishima, Hideo Saito