Abstract: A carbon foam comprising linear portions and node portions joining the linear portions, wherein the linear portions have a diameter of 0.1 ?m or more and 10.0 ?m or less, and the carbon foam has a surface with an area of 100 cm2 or more.

Abstract: Provided is a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions; and a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions, where the carbon content is 51 mass % or more, and the mean deviation of coefficient of friction by the Kawabata evaluation system method is 0.006 or less.

Abstract: Provided is a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions; and a carbon foam and a membrane electrode assembly having linear portions and node portions joining the linear portions, where the carbon content is 51 mass % or more, and the mean deviation of coefficient of friction by the Kawabata evaluation system method is 0.006 or less.

Abstract: A carbon foam comprising linear portions and node portions joining the linear portions, wherein the linear portions have a diameter of 0.1 ?m or more and 10.0 ?m or less, and the carbon foam has a surface with an area of 100 cm2 or more.

Abstract: A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: (I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.

Abstract: A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: (I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.

Abstract: A semiconductor light emitting device, which can endure a dicing step for singulation, is superior in resistance to a high/low thermal cycle, and exhibits a high light extraction efficiency, and an optical film, which can be used favorably for producing the semiconductor light emitting device, are to be provided.

Abstract: A semiconductor light emitting device, which can endure a dicing step for singulation, is superior in resistance to a high/low thermal cycle, and exhibits a high light extraction efficiency, and an optical film, which can be used favorably for producing the semiconductor light emitting device, are to be provided.

Abstract: An insulating structure is formed that favorably maintains gap-fill capability of a narrow width pattern in a memory cell while also preventing the formation of cracks in an insulator in a peripheral circuit, and has the memory cell and peripheral circuit within the same layer. The present invention provides an insulating structure comprising a substrate and a circuit pattern formed on the substrate, wherein the circuit pattern has a narrow width region having a narrow width pattern of a width of 30 nm or less and a wide width region having a wide width pattern of a width of greater than 100 nm in the same layer, and the same insulating composition is formed within the narrow width pattern and within the wide width pattern.