Patents by Inventor Shozo Yamana

Shozo Yamana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6042933
    Abstract: Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.
    Type: Grant
    Filed: August 13, 1998
    Date of Patent: March 28, 2000
    Assignees: Hitachi Chemical Company, Ltd., Technopolis Hakodata Industrial Technology Promotion Organization
    Inventors: Keizo Hirai, Hiroshi Wada, Akihiro Sasaki, Hisashi Kaga, Junichi Kikuchi, Shozo Yamana, Hideji Kuwajima
  • Patent number: 5951918
    Abstract: An electroconductive paste for forming an electric circuit which is low in resistivity, high in electroconductivity and minimized in change of resistivity even after a thermal shock test and/or a humidity and DC applied test, can be obtained by using a composite electroconductive powder comprising a flake-like electroconductive powder made of a material such as silver, a silver alloy, a silver-coated copper powder or a silver-coated copper alloy powder and an unsteady-shaped electroconductive powder such as a reduced silver powder.
    Type: Grant
    Filed: August 5, 1997
    Date of Patent: September 14, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hideji Kuwajima, Shozo Yamana, Junichi Kikuchi, Hisashi Dokochi, Toshikazu Ono, Yoshikatsu Mikami, Hiroshi Wada
  • Patent number: 5840432
    Abstract: Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.
    Type: Grant
    Filed: February 8, 1996
    Date of Patent: November 24, 1998
    Assignees: Hitachi Chemical Company, Ltd., Technopolis Hakodate Industrial Technology
    Inventors: Keizo Hirai, Hiroshi Wada, Akihiro Sasaki, Hisashi Kaga, Junichi Kikuchi, Shozo Yamana, Hideji Kuwajima
  • Patent number: 5238911
    Abstract: An oxide superconductor of the formula: Bi.sub.1.0 Sr.sub.A Ca.sub.B Mg.sub.C Ba.sub.D Cu.sub.1.0.+-.0.15 O.sub.X wherein A=0.6-1.3, B=0.3-0.9, C=0.01-0.3 and D=0.01-0.3 in atomic ratio, having a 2212 phase with a critical temperature of making electrical resistance zero at about 80K or more, can be produced by firing preferably at 820.degree.-870.degree. C. in a lower oxygen content atmosphere.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: August 24, 1993
    Assignee: Hitachi Chemical Company Ltd.
    Inventors: Hidegi Kuwajima, Keiji Sumiya, Shuichiro Shimoda, Toranosuke Ashizawa, Minoru Ishihara, Shozo Yamana
  • Patent number: 5194421
    Abstract: The present invention provides an oxide superconductor which is mainly composed of bismuth, lead, strontium, calcium, magnesium, and copper and has the composition represented by the formula:Bi.sub.1-A Pb.sub.A Sr.sub.1-B Mg.sub.B Ca.sub.1 Cu.sub.1.7.+-.0.3 Oxwherein A=0.15-0.35 and B=0.05-0.3 in which numerals represent atomic ratio and an oxide superconductor which is mainly composed of bismuth, lead, strontium, calcium, magnesium, barium and copper and has the composition represented by the formula:Bi.sub.1-A Pb.sub.A Sr.sub.1-(B+C) (Mg.sub.B Ba.sub.C)Ca.sub.1 Cu.sub.1.7.+-.0.3 Oxwherein A=0.15-0.35, B=0.05-0.3 and C=0.02-0.2 in which numerals represent atomic ratio. Methods for producing these superconductors are also provided.
    Type: Grant
    Filed: November 20, 1991
    Date of Patent: March 16, 1993
    Assignee: Hitachi Chemical Company
    Inventors: Shuichiro Shimoda, Toranosuke Ashizawa, Keiji Sumiya, Hideji Kuwajima, Minoru Ishihara, Shozo Yamana
  • Patent number: 5147851
    Abstract: A superconducting thick film circuit board or thick film superconductor obtained by forming a rod-like crystal superconducting composite layer comprising a superconductor made of a compound of M-Ba-Cu-O, M being Y and/or a lanthanide element, and a composite of Ag and Pt on a stabilized zirconia substrate has a high Jc value and good superconducting properties.
    Type: Grant
    Filed: October 30, 1989
    Date of Patent: September 15, 1992
    Assignee: Hitachi Chemical Company Ltd.
    Inventors: Shozo Yamana, Hideji Kuwajima, Minoru Ishihara, Keiji Sumiya, Toranosuke Ashizawa, Shuichiro Shimoda