Abstract: A lens displacement mechanism using shaped memory alloy (SMA) applied to an auto-focusing lens module is disclosed. The lens displacement mechanism comprising at least one SMA wire. Two opposite ends of the SMA wire are fixed and a longitudinal mid-point of an intermediate movable portion between the two opposite ends is tightened and is fixed on a corresponding hook disposed on an outer edge of the lens so that the intermediate movable portion is tightened between the two opposite ends. When the SMA wire is heated, the intermediate movable portion contracts to pull the hook of the lens for driving the lens to move and slide along with an optical axis so as to achieve auto-focus control. The present lens displacement mechanism is simple in structure and reflow process. Therefore, the present displacement mechanism is suitable to be used in portable camera or mobile phone or PDA, which needs to be small and have easily mass production by SMT.

Abstract: A lens displacement mechanism using shaped memory alloy (SMA) applied to an auto-focusing lens module is disclosed. The lens displacement mechanism comprising at least one SMA wire. Two opposite ends of the SMA wire are fixed and a longitudinal mid-point of an intermediate movable portion between the two opposite ends is tightened and is fixed on a corresponding hook disposed on an outer edge of the lens so that the intermediate movable portion is tightened between the two opposite ends. When the SMA wire is heated, the intermediate movable portion contracts to pull the hook of the lens for driving the lens to move and slide along with an optical axis so as to achieve auto-focus control. The present lens displacement mechanism is simple in structure and reflow process. Therefore, the present displacement mechanism is suitable to be used in portable camera or mobile phone or PDA, which needs to be small and have easily mass production by SMT.

Abstract: A CIS (Contact Image Sensor) device that doesn't require any optical imaging elements includes a circuit board, a light-emitting module, and an image-sensing module. The light-emitting module is electrically connected with the circuit board. The image-sensing module is electrically connected with the circuit board and disposed beside the light-emitting module. Thereby, a light beam is projected from the light-emitting module to a document to form a bouncing light, and the image-sensing module is adjacent to the document to receive the bouncing light for sensing the image of the document. Hence, the present invention without the known GRIN not only reduces the manufacturing cost and the size of the CIS device, but also solves the known problems of assembly tolerance and large size.

Abstract: An algorithm for rebuilding 1D information into 2D information is proposed, in which a 1D skin pattern sensing module composed of a linearly arranged sensing element array continuously reads 1D near field image information of a skin pattern to be measured. Matched with an algorithm for detecting the relative speed of the continuous 1D information, 2D information of the skin pattern can be obtained.