Abstract: Methods and apparatus are disclosed to cool hardware. An example apparatus to cool a hardware component includes a first substrate; a second substrate couplable to a chassis, the second substrate formed of a metal; and a plurality of malleable fins coupled between the first and second substrates, the malleable fins formed of a thermally conductive material.

Abstract: A heat exchanger for controlling temperature of electrical or electronic components has at least one flat tube with an inlet port and outlet port. A coolant entering through the inlet port passes through multiple heat sinks located within the flat tube before exiting through the outlet port. The heat exchanger has a first heat sink coupled to the flat plate with multiple fins arranged based on a first fin configuration, a second heat sink coupled to the flat plate with multiple fins arranged based on a second fin configuration, and at least one coupling device. The heat sinks are arranged based on a position of one or more components mounted on the flat tube such that the number of heat sink fins is proportional to heating characteristics of the components mounted on the tube.