Patents by Inventor Shreenath Anandakrishnan

Shreenath Anandakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE COATED WITH A THERMAL MANAGEMENT MATERIAL
    Publication number: 20230113973
    Abstract: Herein is described a substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises: a thermal conductive coat deposited on the substrate; and a heat insulation coat deposited on the thermal conductive coat, wherein the heat insulation coat comprises a plant root powder and a resin. A process for coating the substrate with a thermal management material, and an electronic device having a housing comprising a thermal management material is also described herein.
    Type: Application
    Filed: January 8, 2021
    Publication date: April 13, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Shreenath Anandakrishnan, Kuan-Ting Wu