Patents by Inventor Shreshtha Kumar JAISWAL

Shreshtha Kumar JAISWAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated process sequence for hybrid bonding applications
    Publication number: 20240194635
    Abstract: A method for sequencing a hybrid bonding process by double linking a source of dies and a target. The method may include selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding product sequence that includes a first linked bonding sequence for the source and a second linked bonding sequence for the target, determining bonding process chamber allocations and process timing for the source and the target based on the integrated bonding product sequence, and bonding a die from the source to the target using the integrated bonding product sequence.
    Type: Application
    Filed: December 9, 2022
    Publication date: June 13, 2024
    Inventors: Niranjan PINGLE, Jitendra Ratilal BHIMJIYANI, Shreshtha Kumar JAISWAL