Abstract: An example multi-beam, radar based ground speed sensor utilizing a single radar integrated circuit apparatus, is provided. An example multi-beam, radar based ground speed sensor utilizing a single radar integrated circuit includes a single radar integrated circuit configured to generate frequency spectrum data and signal processing circuitry in communication with the single radar integrated circuit. The signal processing circuitry includes at least one processor and at least one memory having computer coded instructions. The computer-coded instructions are configured to, in execution with the processor, configure the signal processing circuitry to receive feedback frequency spectrum data from two or more directed frequency spectrum data beams reflecting of an obstructing surface and determine a ground speed based at least in part on the signal measurements of the returning feedback frequency spectrum data.

Abstract: Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.

Abstract: A sensor assembly for a position sensor is provided. The sensor assembly comprises a data sensor and a communication sensor. The data sensor has a first printed circuit board and the first printed circuit board has a plurality of sensor elements disposed on a first side of the first printed circuit board. The first printed circuit board has a swing angle sensing unit and an inclination sensing unit. The communication sensor is electrically connected to the data sensor. The communication sensor has a second printed circuit board. The second printed circuit board is aligned such that the second printed circuit board faces a second side of the first printed circuit board.

Abstract: Methods and apparatuses related to freeze resistant sensing assemblies are provided. An example pressure sensing assembly may include: a first member defining an aperture, the aperture comprising an inner opening disposed on an inner surface of the first member and an outer opening disposed on an outer surface of the first member; a protection diaphragm disposed on the inner surface of the first member; and a sensing diaphragm disposed in a second member fastened to the first member.

Abstract: A method for correcting a position of an excavation vehicle, the excavation vehicle comprising a cab, a boom, a stick, and a bucket, is provided. The method detects vehicle tilt angle data; calculates tilt-compensated position output for the boom, based on a current boom angle and the detected vehicle tilt angle data; and adjusts the position, based on the tilt-compensated position output.

Abstract: A method for correcting a position of an excavation vehicle, the excavation vehicle comprising a cab, a boom, a stick, and a bucket, is provided. The method detects vehicle tilt angle data; calculates tilt-compensated position output for the boom, based on a current boom angle and the detected vehicle tilt angle data; and adjusts the position, based on the tilt-compensated position output.

Abstract: In general, the disclosure is directed to sealed enclosures and devices that include enclosures for protecting enclosed heat sensitive components from the heat generated by enclosed heat producing components. Heat producing components within the enclosure may be placed to achieve uniform distribution of heat produced by the heat producing components, to optimize the dissipation of heat from the heat producing components to the enclosure, and to minimize the heat experienced by the heat sensitive components. The exterior of the enclosure may be designed to increase thermal dissipation and to protect against thermal radiation.

Abstract: In general, the disclosure is directed to sealed enclosures and devices that include enclosures for protecting enclosed heat sensitive components from the heat generated by enclosed heat producing components. Heat producing components within the enclosure may be placed to achieve uniform distribution of heat produced by the heat producing components, to optimize the dissipation of heat from the heat producing components to the enclosure, and to minimize the heat experienced by the heat sensitive components. The exterior of the enclosure may be designed to increase thermal dissipation and to protect against thermal radiation.