Patents by Inventor Shrikant Bhagwat

Shrikant Bhagwat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240319877
    Abstract: A first volume is maintained at a primary site and a second volume is maintained at a secondary site, where operations to mirror the first volume at the primary site to the second volume at the secondary site are performed while other volumes of the primary site and the secondary site are maintained in a remote copy relationship. Input/Output (I/O) operations comprising writing a metadata on the first volume at the primary site are performed and corresponding read I/O operations are performed on the second volume at the secondary site. In response to determining that the metadata read in two consecutive read I/O operations on the second volume at the secondary site does not reflect updates as requested to be made to the first volume at the primary site, determining that the primary site has failed.
    Type: Application
    Filed: March 23, 2023
    Publication date: September 26, 2024
    Inventors: Abhishek JAISWAL, Subhojit ROY, Bharti SONI, Komal Shailendra SHAH, Shrirang Shrikant BHAGWAT
  • Patent number: 11354204
    Abstract: Described herein are techniques for managing failover in a data center environment interconnected using an internet small computer systems interface (iSCSI) communication protocol, the techniques including receiving, at a host and from a kernel driver, an asynchronous message comprising an indication of a failed path associated with a first node having a first port, a list of internet protocol (IP) addresses associated with a plurality of failover paths including a first failover path associated with a second node having a second port, and an expiration. The techniques further including performing, by the host and before the expiration, a first input/output (I/O) operation on the second port associated with the second node. The techniques further including performing, by the host and after the expiration, a second I/O operation on the first port of the first node.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: June 7, 2022
    Assignee: International Business Machines Corporation
    Inventors: Komal Shailendra Shah, Bharti Soni, Shrirang Shrikant Bhagwat, Sourab Gupta
  • Publication number: 20200379857
    Abstract: Described herein are techniques for managing failover in a data center environment interconnected using an internet small computer systems interface (iSCSI) communication protocol, the techniques including receiving, at a host and from a kernel driver, an asynchronous message comprising an indication of a failed path associated with a first node having a first port, a list of internet protocol (IP) addresses associated with a plurality of failover paths including a first failover path associated with a second node having a second port, and an expiration. The techniques further including performing, by the host and before the expiration, a first input/output (I/O) operation on the second port associated with the second node. The techniques further including performing, by the host and after the expiration, a second I/O operation on the first port of the first node.
    Type: Application
    Filed: June 3, 2019
    Publication date: December 3, 2020
    Inventors: Komal Shailendra Shah, Bharti Soni, Shrirang Shrikant Bhagwat, Sourab Gupta
  • Publication number: 20110097548
    Abstract: A multilayered formable packaging film and a method of manufacturing the film are disclosed. The film is suitable for making blisters either by thermoforming or cold forming. The visible surface of the film has unique features preventing counterfeiting, which features are retained on the film even after blister formation. The film has a thickness not exceeding 1050 microns. The film substrate has a 10-500 micron thickness, is devoid of plasticizer and comprises at least one polymeric resin. A coat of an ester acrylic based primer having a 0.1-1 micron thickness is on a first surface of the substrate. A metallized layer with non-uniform thickness between 0.001 to 0.3 micron is deposited on the coat and embossed. A base having a thickness of 50-1000 microns is on the second surface, the base comprising at least one polymeric resin.
    Type: Application
    Filed: December 19, 2008
    Publication date: April 28, 2011
    Inventors: Mohan Harakchand Bhandari, Praful Ramchandra Naik, Ajith Shashidharan, Sanjeev Kulkarni, Shrikant Bhagwat, Sudhir Naik, Anirudha Sant, Ganesh Gudsoorkar