Patents by Inventor Shrikant Dhodapkar
Shrikant Dhodapkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11898015Abstract: A process to form coated polymer particles comprising polymer particles formed from a polymer composition comprising an olefin-based polymer, and a coating formed from a coating composition comprising an aqueous metal acid dispersion and an aqueous polysiloxane emulsion, said process comprising the following: mixing together the aqueous metal acid dispersion and the aqueous polysiloxane emulsion to form a dispersion/emulsion mixture; applying the dispersion/emulsion mixture to a portion of the surfaces of the polymer particles to form wet-coated polymer particles; drying the wet-coated polymer particles to form the coated polymer particles. The aqueous metal acid dispersion and the aqueous polysiloxane emulsion may also be applied, individually, in separate steps.Type: GrantFiled: June 28, 2019Date of Patent: February 13, 2024Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Remi A. Trottier, George W. Haun, Jr., Harold W. Boone, Intan M. Hamdan, Michael D. Turner
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Patent number: 11873400Abstract: A composition comprising the following components: A) a metal stearate; B) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, wherein x=7; C) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, C wherein x=20; D) octanoic acid; E) sodium lauryl sulfate; F) a polydimethylsiloxane (PDMS); and G) water.Type: GrantFiled: June 25, 2019Date of Patent: January 16, 2024Assignees: Dow Global Technologies LLC, Rohm and Haas CompanyInventors: Nicholas B. Schaffer, Kevin J. Bouck, Sarah E. Decato, Shrikant Dhodapkar, Intan M. Hamdan, Remi A. Trottier, Richard A. Lundgard
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Patent number: 11608390Abstract: Disclosed herein is a system for solution polymerization comprising a reactor system that is operative to receive a monomer and to react the monomer to form a polymer; a plurality of devolatilization vessels located downstream of the reactor system, where each devolatilization vessel operates at a lower pressure than the preceding devolatilization vessel; and a heat exchanger disposed between two devolatilization vessels and in fluid communication with them, where the heat exchanger has an inlet port temperature of 100° C. to 230° C., an outlet port temperature of 200° C. to 300° C., an inlet port pressure of 35 to 250 kgf/cm2 and an outlet port pressure of 20 to 200 kgf/cm2; and wherein the polymer solution remains in a single phase during its residence in the heat exchanger.Type: GrantFiled: May 30, 2019Date of Patent: March 21, 2023Assignee: DOW GLOBAL TECHNOLOGIES LLCInventors: Maria Pollard, Robert D. Swindoll, Pradeep Jain, Alec Y. Wang, Jorge Rubalcaba, Shrikant Dhodapkar, Sean W. Ewart, Bradley K. Blanchard, George W. Haun, Jr., Michael J. Zogg, Jr.
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Publication number: 20220274766Abstract: A unitized load cover includes a top panel, at least one first side panel coupled to the top panel and extending downward from the top panel, and at least one second side panel coupled to the top panel and extending downward from the top panel. One of the second side panels can be next to or across from one of the first side panel. An average thickness of the first side panel is greater than an average thickness of the second side panel, where the average thickness of a panel is a distance between an outside surface and an inside surface of the panel averaged over a surface area of the panel. The first side panel, second side panel, and top panel define a cavity configured to receive at least one unitized load.Type: ApplicationFiled: July 6, 2020Publication date: September 1, 2022Applicant: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Rocklyn P. Gravouilla, Karla M. Sperati, Alyssa L. Croasmun
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Patent number: 11421085Abstract: The present disclosure provides a packaging process and the resultant package produced from the process. The process includes introducing, into a mixing device, pellets composed of ethylene/propylene/diene polymer (EPDM). The EPDM comprises greater than 60 wt % units derived from ethylene. The pellets have a residual moisture content from 500 ppm to 2500 ppm. The process includes adding a silica-based powder to the mixing device and coating at least a portion of the pellets with the silica-based powder. The process includes sealing a bulk amount of the coated pellets in a bag made of a flexible polymeric film. The process includes absorbing, with the silica-based powder, the residual moisture from the pellets, and preventing moisture condensation in the bag interior for a period from 7 days after the sealing step to 1000 days after the sealing step.Type: GrantFiled: May 8, 2019Date of Patent: August 23, 2022Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Remi A. Trottier, Santosh S. Bawiskar, Kyle D. Anderson
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Patent number: 11355261Abstract: A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.Type: GrantFiled: December 14, 2017Date of Patent: June 7, 2022Assignee: DOW GLOBAL TECHNOLOGIES LLCInventors: Yichi Zhang, Timothy J. Person, Shrikant Dhodapkar, Remi A. Trottier
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Patent number: 11338974Abstract: Packaging configuration comprising: a pallet comprising a top surface, a bottom surface and a height HP; a first stack of bagged goods having a total height HL1, stacked on the pallet and comprising at least two layers; and a support structure comprising at least four walls situated over the first stack of bagged goods, one of the walls being a top wall and at least three of the walls being sidewalls. The support structure has a height HC that meets one of the following equations: HC>HL1, when the bottom end of at least one sidewall of the support structure is positioned on the top surface of the at least one pallet; or HC>HP+HL1, when the bottom end of at least one sidewall of the support structure and the bottom surface of the pallet are both positioned on the same surface. An air gap having a height HAG is situated between a top layer of the first stack of bagged goods and the top wall of the support structure.Type: GrantFiled: August 8, 2017Date of Patent: May 24, 2022Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Rocklyn P. Gravouilla, William B. Bellefontaine, Fernanda Bortolane Bueno
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Patent number: 11248075Abstract: The invention provides compositions, each comprising an ethylene/alpha-olefin interpolymer, which has a reduced level of a low density, low molecular weight oligomeric fraction, as indicated by an HCC value, as described herein, and reduced levels of inorganic content or lower Tm. The invention also provides processes for forming such interpolymers.Type: GrantFiled: October 16, 2019Date of Patent: February 15, 2022Assignee: Dow Global Technologies LLCInventors: Frank J. Cerk, Rongjuan Cong, Shrikant Dhodapkar, Selim Yalvac, Morgan M. Hughes, Timothy W. Gambrel, Yi Jin
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Publication number: 20210380790Abstract: A process to make a friable bale, and a friable bale formed from the same, wherein the friable bale is formed from a composition comprising coated polymer particles, which comprise polymer particles formed from a polymer composition comprising an olefin-based polymer, and a coating formed from a coating composition comprising an aqueous metal acid dispersion, and an aqueous polysiloxane emulsion, and wherein the friable bale has a compression force ?1.00 MPa.Type: ApplicationFiled: June 6, 2019Publication date: December 9, 2021Inventors: Guang Ming Li, Shrikant Dhodapkar, Rerni A. Trottier, Gerrit Grootenzerink, Jozef J. I. Van Dun
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Publication number: 20210363310Abstract: A process to form coated polymer particles comprising polymer particles formed from a polymer composition comprising an olefin-based polymer, and a coating formed from a coating composition comprising an aqueous metal acid dispersion and an aqueous polysiloxane emulsion, said process comprising the following: mixing together the aqueous metal acid dispersion and the aqueous polysiloxane emulsion to form a dispersion/emulsion mixture; applying the dispersion/emulsion mixture to a portion of the surfaces of the polymer particles to form wet-coated polymer particles; drying the wet-coated polymer particles to form the coated polymer particles. The aqueous metal acid dispersion and the aqueous polysiloxane emulsion may also be applied, individually, in separate steps.Type: ApplicationFiled: June 28, 2019Publication date: November 25, 2021Inventors: Shrikant Dhodapkar, Remi A. Trottler, George W. Haun, Harold W. Boone, Intan M. Hamdan, Michael D. Turner
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Patent number: 11136427Abstract: A process to form a first composition comprising a functionalized olefin-based polymer comprises: a) polymerizing a composition comprising an olefin to form a reaction product comprising an olefin-based polymer; b) subjecting at least a portion of the reaction product to at least one devolatilization to form a polymer-rich melt, wherein step b) occurs downstream from and in-line with step a); and c) reacting at least a portion of the polymer-rich melt with at least one functionalization agent and, optionally, at least one free-radical initiator to form the first composition, wherein step c) occurs downstream from and in-line with step b), wherein “the viscosity of the functionalized olefin-based polymer (177° C./350° F.)” to “the viscosity of the olefin-based polymer (177° C./350° F.)” is from 0.1 to 5.0.Type: GrantFiled: September 22, 2016Date of Patent: October 5, 2021Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Gregory E. Johnson, Rennisha R. Wickham, Santosh S. Bawiskar, Guang Ming Li, Harold W. Boone
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Publication number: 20210284412Abstract: Packaging configuration comprising: a pallet comprising a top surface, a bottom surface and a height HP; a first stack of bagged goods having a total height HL 1, stacked on the pallet and comprising at least two layers; and a support structure comprising at least four walls situated over the first stack of bagged goods, one of the walls being a top wall and at least three of the walls being sidewalls. The support structure has a height HC that meets one of the following equations: HC>HL 1, when the bottom end of at least one sidewall of the support structure is positioned on the top surface of the at least one pallet; or HC>HP+HL 1, when the bottom end of at least one sidewall of the support structure and the bottom surface of the pallet are both positioned on the same surface. An air gap having a height HAG is situated between a top layer of the first stack of bagged goods and the top wall of the support structure.Type: ApplicationFiled: August 8, 2017Publication date: September 16, 2021Inventors: Shrikant Dhodapkar, Rocklyn P. Gravouilla, William B. Bellefontaine, Fernanda Bortolane Bueno
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Publication number: 20210246235Abstract: A devolatilizer (devo), which operates at a temperature (T) and at a pressure (P), for the separation of at least a portion of a solvent from a polymer-rich solution comprising the solvent and a polymer, and wherein the devolatilizer comprises at least the following components: A) a distributor, a heater, or a heater/distributor combination; B) a shroud (component B) located around some or all of the periphery of component A; and C) a gap (component C) located between the outer surface of component A and the inner surface of component B.Type: ApplicationFiled: May 31, 2019Publication date: August 12, 2021Inventors: Maria Pollard, Irfan Khan, Shrikant Dhodapkar, Martin Lopez, Quan Yuan
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Publication number: 20210214470Abstract: Disclosed herein is a system for solution polymerization comprising a reactor system that is operative to receive a monomer and to react the monomer to form a polymer; a plurality of devolatilization vessels located downstream of the reactor system, where each devolatilization vessel operates at a lower pressure than the preceding devolatilization vessel; and a heat exchanger disposed between two devolatilization vessels and in fluid communication with them, where the heat exchanger has an inlet port temperature of 100° C. to 230° C., an outlet port temperature of 200° C. to 300° C., an inlet port pressure of 35 to 250 kgf/cm2 and an outlet port pressure of 20 to 200 kgf/cm2; and wherein the polymer solution remains in a single phase during its residence in the heat exchanger.Type: ApplicationFiled: May 30, 2019Publication date: July 15, 2021Inventors: Maria Pollard, Robert D. Swindoll, Pradeep Jain, Alec Y. Wang, Jorge Rubalcaba, Shrikant Dhodapkar, Sean W. Ewart, Bradley K. Blanchard, George W. Haun, Jr., Michael J. Zogg, Jr.
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Publication number: 20210155798Abstract: A composition comprising the following components: A) a metal stearate; B) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, wherein x=7; C) a secondary alcohol ethoxylate of the formula C12-14H25-29O [CH2CH2O]xH, C wherein x=20; D) octanoic acid; E) sodium lauryl sulfate; F) a polydimethylsiloxane (PDMS); and G) water.Type: ApplicationFiled: June 25, 2019Publication date: May 27, 2021Inventors: Nicholas B. Schaffer, Kevin J. Bouck, Sarah E. Decato, Shrikant Dhodapkar, Intan M. Hamdan, Remi A. Trottier, Richard A. Lundgard
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Patent number: 10683398Abstract: A composition is provided that comprises at least the following: polymer particles comprising a coating on at least a portion of the total surface of the polymer particles, and wherein the coating is formed from a powder composition comprising at least one inorganic powder, and at least one organic powder selected from a metal stearate and/or a polymer powder, and wherein the weight ratio of the total amount of the inorganic powder to the total amount of the organic powder is from 3.0 to 50.0.Type: GrantFiled: September 16, 2016Date of Patent: June 16, 2020Assignee: Dow Global Technologies LLCInventors: Shrikant Dhodapkar, Remi A. Trottier, Robert Bellair, Konanur Manjunath, Pradeep Jain, Michael D. Turner
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Publication number: 20200048385Abstract: The invention provides compositions, each comprising an ethylene/alpha-olefin interpolymer, which has a reduced level of a low density, low molecular weight oligomeric fraction, as indicated by an HCC value, as described herein, and reduced levels of inorganic content or lower Tm. The invention also provides processes for forming such interpolymers.Type: ApplicationFiled: October 16, 2019Publication date: February 13, 2020Inventors: Frank J. Cerk, Rongjuan Cong, Shrikant Dhodapkar, Selim Yalvac, Morgan M. Hughes, Timothy W. Gambrel, Yi Jin
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Publication number: 20190348193Abstract: A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.Type: ApplicationFiled: December 14, 2017Publication date: November 14, 2019Inventors: Yichi Zhang, Timothy J. Person, Shrikant Dhodapkar, Remi A. Trottier
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Patent number: 10450393Abstract: The invention provides compositions, each comprising an ethylene/alpha-olefin interpolymer, which has a reduced level of a low density, low molecular weight oligomeric fraction, as indicated by an HCC value, as described herein, and reduced levels of inorganic content or lower Tm. The invention also provides processes for forming such interpolymers.Type: GrantFiled: May 7, 2019Date of Patent: October 22, 2019Assignee: Dow Global Technologies LLCInventors: Frank J. Cerk, Rongjuan Cong, Shrikant Dhodapkar, Selim Yalvac, Morgan M. Hughes, Timothy W. Gambrel, Yi Jin
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Publication number: 20190263950Abstract: The invention provides compositions, each comprising an ethylene/alpha-olefin interpolymer, which has a reduced level of a low density, low molecular weight oligomeric fraction, as indicated by an HCC value, as described herein, and reduced levels of inorganic content or lower Tm. The invention also provides processes for forming such interpolymers.Type: ApplicationFiled: May 7, 2019Publication date: August 29, 2019Inventors: Frank J. Cerk, Rongjuan Cong, Shrikant Dhodapkar, Selim Yalvac, Morgan M. Hughes, Timothy W. Gambrel, Yi Jin