Abstract: The disclosure generally relates to transcription of spoken words, and more particularly to a system and method for transcription of spoken words using multilingual mismatched words. The process comprises collection of multi-scripted noisy transcriptions of the spoken word obtained from workers of the multilingual mismatched crowd unfamiliar with the spoken language. The collected words are mapped to a phoneme sequence in the source language using script specific graphemes to phoneme model. Further, it builds a multi-scripted transcription script specific, worker specific and a global insertion-deletion-substitution (IDS) channel. Furthermore, the disclosure also determines reputation of workers to allocate the transcription task. Determination of reputation is based on word belief.

Abstract: The disclosure generally relates to transcription of spoken words, and more particularly to a system and method for transcription of spoken words using multilingual mismatched words. The process comprises collection of multi-scripted noisy transcriptions of the spoken word obtained from workers of the multilingual mismatched crowd. The collected words are mapped to a phoneme sequence in the source language using script specific graphemes to phoneme model. Further, it builds a multi-scripted transcription script specific, worker specific and a global insertion-deletion-substitution (IDS) channel. Furthermore, the disclosure also determines reputation of workers to allocate the transcription task. Determination of reputation is based on word belief.

Abstract: A portable air conditioner comprises a tank for storing a liquid therein, a plurality of tubes, and at least one fin disposed between adjacent tubes. The tubes are spaced from one another defining an air passageway therebetween having an air inlet and a dry air outlet. Each tube has a first end extending into the tank in fluid communication with the liquid and a second end extending opposite the tank defining a wet air outlet and a wicking material disposed therein and in fluid communication with the liquid. A sheet valve sealingly engages the dry air outlet and the wet air outlet and is moveable for adjusting an amount of air flow exiting from the dry air outlet and the wet air outlet. At least one aperture is defined within each of the tubes between the ends to divert air flowing through the air passageway into the tubes.

Abstract: A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.

Abstract: A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is disposed within one or more boiling chambers. Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top. The condenser tubes receive and condense vapor boiled off from the refrigerant. Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.

Abstract: The invention provides a heat exchanger assembly for cooling an electronic device wherein the upper portion of the housing includes a plurality of condensing tubes extending upwardly from the lower portion of the housing. A plurality of air heat transfer fins zigzag transversely to a primary axis (A) between adjacent ones of the condensing tubes for dissipating heat from vapor boiled off of the refrigerant. At least two next adjacent condensing tubes of the plurality diverge upwardly from the bottom ends toward the top distal ends thereof. Accordingly, the space containing the air heat transfer fins between the two next adjacent condensing tubes is greater at the top distal ends than at the bottom ends of the condensing tubes. The condensing tubes can either have a constant cross-section with diverging tube axes or can have a decreasing cross-section from bottom to top with parallel tube axes.

Abstract: An orientation insensitive heat exchanger assembly includes a housing having an upper portion including condensing tubes extending upwardly and intersecting a top wall of the lower portion. The condensing tubes are spaced equally from one another circumferentially and radially from the central axis and extend outwardly at a predetermined angle from the central axis. A fan assembly is disposed along a central axis extending upwardly from a center of the housing wherein the condensing tubes surround the fan assembly and the fan moves air radially out through the spaces between the condensing tubes.

Abstract: The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid surface and a second sector of each coil disposed above the liquid surface whereby said tube runs into and out of said liquid refrigerant.

Abstract: A thermosiphon cooling assembly includes a housing having a lower portion and an upper portion. A refrigerant is disposed in the lower portion for liquid-to-vapor transformation. A boiler plate defines an outer bottom wall of the housing for transferring heat from the electronic device to the refrigerant. This transfer of heat to the refrigerant leads to a liquid-to-vapor transformation and a pressure build up in the housing. The boiler plate is flexible for reacting with the electronic device in response to the pressure build up in the housing. The boiler plate includes an inflexible first area for overlying the electronic device and a flexible second area which surrounds the first area of the boiler plate. The second area has a thickness t2 less than the thickness t, of the first area thus allowing the boiler plate to flex in the second area.

Abstract: A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.

Abstract: The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about the central axis of the base. The upper chamber includes a lid defining an inlet and an inlet tube interconnecting the upper chamber and the lower chamber for directing a fluid through the upper chamber and impinging the fluid on the base in the lower chamber. A sidewall extends between the base and the lid and is disposed about the fins. The sidewall includes a peripheral inlet for directing the fluid perpendicular to the central axis and at the fins.

Abstract: The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the channels decreasing in number with an increase in the distance from the electronic device, thus giving the heat sink a trapezoidal cross section perpendicular to the channels.

Abstract: An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for removing heat produced by the electronic devices. The evaporative cooler removes heat from the flow of air by absorbing heat from the flow of air and then dissipating the heat by evaporating a liquid into a secondary airflow, which is directed out of the cabinet. The cabinet includes a cold air plenum having an actuator for adjusting a cross-sectional area of the cold air plenum to control the airflow through each of the supports.

Abstract: A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit position to define a tangential outlet between said exit positions. Each of a plurality of curved fins presents a concave surface and a convex surface and extends from an inner circle with radius concentric with the inlet axis to an outer circle with radius concentric with the inlet axis to define a plurality of curved channels between adjacent fins for directing the flow of cooling fluid radially from the inlet axis. Each of the curved channels is disposed at a constant distance between next adjacent fins for a major length there along from the inner circle with radius toward the outer circle with radius.

Abstract: The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto the fins and is disposed above the base plate and below the top extremity of the fins. The flow of cooling fluid is discharged from the nozzle adjacent the base plate and then flows upwardly through the fins to remove the heat from the base plate before removing any heat from the fins.

Abstract: A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and is flexible to vary the volume of the upper portion for modulating the flow of coolant fluid through the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.

Abstract: The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also includes a finger member having a rounded tip centered on the top surface. The heat sink device also includes a force generating device having an anvil spaced from the finger member and a compressible member compressed between the anvil and the finger member. The compressible member generates a pressing force urging the finger member and the top surface together. The heat sink device also includes a moving device operable to move one of the anvil and the finger member relative to the other to change the pressing force generated by the compressible member.

Abstract: A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.

Abstract: A heat exchanger for a heating, ventilating and air conditioning system comprises a plurality of heat exchange tubes extending between a pair of spaced header tanks and arranged in groups of tubes with varying number of tubes in each group to cause a refrigerant to flow in multiple passes in the interior of the tubes across another fluid flowing on the exterior of the tubes. The heat exchange tubes comprise a plurality of flow passages having at least one corner formed by a pair of straight or arcuate sides with an included angle of less than or equal to ninety degrees, more preferably less than or equal to thirty degrees, to promote intense pool boiling within the flow passages. In addition to at least one corner region, the flow passage has a passage-specific optimal hydraulic diameter determined by the relationship between the optimal hydraulic diameter of the passage and the optimal hydraulic diameter of a baseline circular passage.