Abstract: A method for the removal of residues comprising silicon from at least a portion of the top and back of a substrate and/or deposition apparatus is disclosed herein. In one aspect, there is provided a method for removing residues comprising: treating the coated substrate and/or deposition apparatus with a removal solvent.

Abstract: Silica-based materials and films having a dielectric constant of 3.7 or below and compositions and methods for making and using same are disclosed herein. In one aspect, there is provided a composition for preparing a silica-based material comprising an at least one silica source, a solvent, an at least one porogen, optionally a catalyst, and optionally a flow additive wherein the solvent boils at a temperature ranging from 90° C. to 170° C. and is selected from the group of compounds represented by the following formulas: HO—CHR8—CHR9—CH2—CHR10R11 where R8, R9, R10 and R11 can independently be an alkyl group ranging from 1 to 4 carbon atoms or a hydrogen atom; and R12—CO—R13 where R12 is a hydrocarbon group having from 3 to 6 carbon atoms; R13 is a hydrocarbon group having from 1 to 3 carbon atoms; and mixtures thereof.

Abstract: The synthesis of liquid molding resins derived from plant oils that are capable of curing to high modulus thermosetting polymers and composites is described in this invention. The resins described resemble the unsaturated polyester, vinyl ester and epoxy resins presently used as the polymer matrix material in high performance glass, carbon, aramid and natural fiber reinforced composite materials. The resins disclosed herein are suitable for polymer and composite manufacture by Resin Transfer Molding (RTM), Reaction Injection Molding (RIM), Vacuum Assisted Resin Transfer Molding (VARTM), Seeman's Composite Resin Infusion Manufacturing Process (SCRIMP), Atmospheric Pressure Molding (APM), open mold casting, spray-up, Sheet Molding Compound (SMC) Bulk Molding Compound (BMC), filament winding, pultrusion, prepregs, lamination and compression molding.